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HGT1S10N120BNS - onsemi

Description: Low Saturation Voltage : V CE(sat) = 2.45 V @ I C = 10A; Typical Fall Time. . . . . . . . . .140ns at TJ = 150°C; Low Conduction Loss; 17A, 1200V, TC = 110°C; Short Circuit Rating

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HGT1S10N120BNS Details

  • Manufacturer Part Number:

    HGT1S10N120BNS

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK-3 / TO-263-2

  • Manufacturer Package Code:

    418AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW CONDUCTION LOSS

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    35 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE

  • Fall Time-Max (tf):

    200 ns

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    298 W

  • Qualification Status:

    Not Qualified

  • Rise Time-Max (tr):

    15 ns

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    MOTOR CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    450 ns

  • Turn-off Time-Nom (toff):

    330 ns

  • Turn-on Time-Max (ton):

    40 ns

  • Turn-on Time-Nom (ton):

    32 ns

  • VCEsat-Max:

    4.2 V

HGT1S10N120BNS Frequently Asked Questions (FAQs)

  • The maximum allowed power dissipation for the HGT1S10N120BNS is dependent on the thermal impedance of the system and the maximum allowed junction temperature. A general guideline is to keep the power dissipation below 200W to ensure reliable operation.
  • Proper cooling of the HGT1S10N120BNS can be achieved by using a heat sink with a thermal resistance of less than 0.5°C/W, ensuring good thermal contact between the module and heat sink, and providing adequate airflow to dissipate heat.
  • The recommended gate resistance for the HGT1S10N120BNS is between 10Ω and 20Ω to ensure proper switching characteristics and to minimize electromagnetic interference (EMI).
  • Yes, the HGT1S10N120BNS can be used in a parallel configuration, but it is essential to ensure that the modules are matched in terms of their electrical characteristics, and that the gate drive circuits are properly synchronized to prevent uneven current sharing.
  • The maximum allowed dv/dt for the HGT1S10N120BNS is 5kV/μs to prevent false triggering and ensure reliable operation.

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Part Image HGT1S10N120BNST Fairchild Semiconductor Corporation

Insulated Gate Bipolar Transistor, 35A I(C), 1200V V(BR)CES, N-Channel, TO-263AB

Part Image HGT1S10N120BNS Harris Semiconductor

Insulated Gate Bipolar Transistor, 35A I(C), 1200V V(BR)CES, N-Channel, TO-263AB