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HGT1S10N120BNST - onsemi

Description: Low Saturation Voltage : V CE(sat) = 2.45 V @ I C = 10A; Typical Fall Time. . . . . . . . . .140ns at TJ = 150°C; Low Conduction Loss; 17A, 1200V, TC = 110°C; Short Circuit Rating

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PCB Footprints
HGT1S10N120BNST - onsemi PCB footprint - Other - Other - D2PAK−3 (TO−263, 3−LEAD) CASE 418AJ ISSUE B
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3D Models
HGT1S10N120BNST - onsemi  - 3D model - Other - D2PAK−3 (TO−263, 3−LEAD) CASE 418AJ ISSUE B
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HGT1S10N120BNST Details

  • Manufacturer Part Number:

    HGT1S10N120BNST

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK-3 / TO-263-2

  • Manufacturer Package Code:

    418AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    LOW CONDUCTION LOSS

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    35 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    298 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    MOTOR CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    265 ns

  • Turn-on Time-Nom (ton):

    34 ns

  • VCEsat-Max:

    4.2 V

HGT1S10N120BNST Frequently Asked Questions (FAQs)

  • The maximum allowed power dissipation for the HGT1S10N120BNST is dependent on the thermal impedance of the system and the maximum allowed junction temperature. A general guideline is to keep the power dissipation below 200W to ensure reliable operation.
  • Proper cooling of the IGBT module can be achieved by ensuring good thermal contact between the module and the heat sink, using a thermal interface material, and providing adequate airflow or liquid cooling to dissipate the heat.
  • The recommended gate resistor value for the HGT1S10N120BNST is typically in the range of 10-20 ohms, but may vary depending on the specific application and switching frequency.
  • Yes, the HGT1S10N120BNST can be used in a parallel configuration, but it is essential to ensure that the modules are properly matched and that the gate drive and control circuits are designed to handle the parallel configuration.
  • The maximum allowed dv/dt for the HGT1S10N120BNST is 5kV/μs, but it is recommended to limit dv/dt to 1-2kV/μs to ensure reliable operation and minimize electromagnetic interference (EMI).

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HGT1S10N120BNST Overview

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Part Image HGT1S10N120BNST Fairchild Semiconductor Corporation

Insulated Gate Bipolar Transistor, 35A I(C), 1200V V(BR)CES, N-Channel, TO-263AB

Part Image HGT1S10N120BNS Harris Semiconductor

Insulated Gate Bipolar Transistor, 35A I(C), 1200V V(BR)CES, N-Channel, TO-263AB

Part Image HGT1S10N120BNS onsemi

Insulated Gate Bipolar Transistor, 35A I(C), 1200V V(BR)CES, N-Channel, TO-263AB