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ISL3158EIUZ-T - Renesas Electronics

Description: The ISL315xE family of 5V powered RS-485/RS-422 transceivers features high output drive and high ESD protection. The devices withstand ±16. 5kV IEC61000-4- 2 ESD strikes without latch-up. The large output voltage of 3. 1V typical into a 54Ω load provides high noise immunity, and enables the drive of up to 8000ft long bus segments, or eight 120Ω terminations in a star topology. These devices possess less than 125μA bus input currents, thus constituting a true 1/8 unit load. The high output drive combined wit

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ISL3158EIUZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.118
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ISL3158EIUZ-T - Renesas Electronics  - 3D model - Small Outline Packages - M8.118
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ISL3158EIUZ-T Details

  • Manufacturer Part Number:

    ISL3158EIUZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.118

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2.4 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    45 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    30 ns

  • Width:

    3 mm

ISL3158EIUZ-T Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital signal traces separate and avoid crossing them over each other.
  • Ensure that the device is properly decoupled with 0.1uF and 10uF capacitors, and that the PCB is designed to minimize thermal gradients. Also, follow the recommended operating conditions and derating guidelines.
  • The maximum cable length depends on the specific application and the type of cable used. As a general guideline, the ISL3158EIUZ-T can support cable lengths up to 100 meters at 100Mbps. However, it's recommended to consult the datasheet and application notes for specific guidance.
  • Use a logic analyzer or oscilloscope to capture waveforms and debug the issue. Check the power supply, clock signals, and data transmission lines. Consult the datasheet, application notes, and Renesas support resources for troubleshooting guides and FAQs.
  • Follow proper PCB design and layout guidelines to minimize EMI and RFI. Use shielding, filtering, and grounding techniques to reduce emissions and improve immunity. Consult the datasheet and application notes for specific guidance on EMI and RFI mitigation.

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