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XC2S30-5VQ100C - AMD

Description: FPGA - Field Programmable Gate Array 30000 SYSTEM GATE 2.5 VOLT LOGIC CELL ARRAY

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XC2S30-5VQ100C - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - VQG100C
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XC2S30-5VQ100C - AMD  - 3D model - Quad Flat Packages - VQG100C
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XC2S30-5VQ100C Details

  • Manufacturer Part Number:

    XC2S30-5VQ100C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFP-100

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Additional Feature:

    MAXIMUM USABLE GATES 30000

  • Clock Frequency-Max:

    263 MHz

  • Combinatorial Delay of a CLB-Max:

    0.7 ns

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    216

  • Number of Equivalent Gates:

    30000

  • Number of Inputs:

    64

  • Number of Logic Cells:

    972

  • Number of Outputs:

    60

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Organization:

    216 CLBS, 30000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    150 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

XC2S30-5VQ100C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC2S30-5VQ100C is -40°C to 100°C (industrial grade) and 0°C to 70°C (commercial grade).
  • To implement a CDC in XC2S30-5VQ100C, use a synchronizer circuit or a FIFO-based CDC. The Xilinx ISE design suite provides tools and IP cores to help with CDC implementation.
  • The maximum frequency achievable with XC2S30-5VQ100C depends on the design complexity, clocking scheme, and routing. However, the FPGA can support clock frequencies up to 200 MHz.
  • To configure XC2S30-5VQ100C for low power consumption, use the Xilinx Power Estimator (XPE) tool to analyze and optimize power consumption. Techniques include clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • Yes, XC2S30-5VQ100C is suitable for high-reliability applications due to its radiation-hardened design and compliance with various industry standards for reliability and fault tolerance.

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XC2S30-5VQ100C Overview

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Image Part Number Model
Part Image XC2S30-5VQ100C AMD Xilinx

Field Programmable Gate Array, 216 CLBs, 30000 Gates, 263MHz, 972-Cell, PQFP100

Part Image XC2S30-5VQG100I AMD Xilinx

Field Programmable Gate Array, 216 CLBs, 30000 Gates, 263MHz, 972-Cell, PQFP100

Part Image XC2S30-5VQG100C AMD

Field Programmable Gate Array, 216 CLBs, 30000 Gates, 263MHz, 972-Cell, PQFP100

Part Image XC2S30-5VQG100I AMD

Field Programmable Gate Array, 216 CLBs, 30000 Gates, 263MHz, 972-Cell, PQFP100

Part Image XC2S30-5VQ100I AMD

Field Programmable Gate Array, 216 CLBs, 30000 Gates, 263MHz, 972-Cell, PQFP100

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