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XCKU060-1FFVA1517I - AMD

Description: XILINX - XCKU060-1FFVA1517I - FPGA, KINTEX ULTRASCALE, FCBGA-1517

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XCKU060-1FFVA1517I - AMD PCB footprint - BGA - BGA - FFVA1517
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XCKU060-1FFVA1517I - AMD  - 3D model - BGA - FFVA1517
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XCKU060-1FFVA1517I Details

  • Manufacturer Part Number:

    XCKU060-1FFVA1517I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1517

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    2760

  • Number of Inputs:

    624

  • Number of Logic Cells:

    725550

  • Number of Outputs:

    624

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2760 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.51 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

XCKU060-1FFVA1517I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU060-1FFVA1517I is approximately 12W, but this can vary depending on the specific design and operating conditions.
  • To implement a reliable clocking scheme, use the FPGA's built-in clocking resources, such as the Mixed-Mode Clock Manager (MMCM) or the Phase-Locked Loop (PLL). These resources can help generate stable clock signals and minimize clock skew.
  • To optimize your design for area and speed, use the Vivado Design Suite's built-in optimization tools, such as the 'Report Clock Utilization' and 'Report Area Utilization' reports. Additionally, consider using pipelining, retiming, and other optimization techniques to improve performance and reduce area usage.
  • To ensure reliable data transfer between the FPGA and external memory, use the FPGA's built-in memory controllers, such as the Memory Interface Generator (MIG). Additionally, implement error correction mechanisms, such as ECC or CRC, to detect and correct data errors.
  • The XCKU060-1FFVA1517I has a maximum junction temperature of 100°C. To ensure reliable operation, implement proper thermal management techniques, such as heat sinking, thermal interface materials, and airflow management, to keep the device within its recommended operating temperature range.

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XCKU060-1FFVA1517I Overview

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Part Image XCKU060-1FFVA1517C AMD

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Part Image XCKU060-1FFVA1517E AMD

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Part Image XCKU060-1FFVA1517I AMD Xilinx

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Part Image XCKU060-1FFVA1517C AMD Xilinx

Field Programmable Gate Array, 2760 CLBs, 725550-Cell, PBGA1517