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AMC1304M25DWR - Texas Instruments

Description: 1-Channel Single ADC Delta-Sigma 20Msps 16-bit Serial CMOS 16-Pin SOIC T/R

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AMC1304M25DWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016B
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AMC1304M25DWR Details

  • Manufacturer Part Number:

    AMC1304M25DWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Peak-to-peak input voltage range(V) : 250mV

  • Analog Input Voltage-Max:

    0.0625 V

  • Analog Input Voltage-Min:

    -0.0625 V

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Linearity Error-Max (EL):

    0.006103%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    20 MHz

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

AMC1304M25DWR Frequently Asked Questions (FAQs)

  • A good PCB layout for the AMC1304M25DWR involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce noise and improve performance.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the internal offset and gain registers accordingly. Additionally, consider using an external voltage reference and a precision resistor network to improve calibration accuracy.
  • The AMC1304M25DWR has a maximum junction temperature of 150°C. To ensure reliable operation, ensure good thermal conduction between the device and the PCB, use a heat sink if necessary, and avoid exceeding the maximum power dissipation. Additionally, consider using thermal simulation tools to model the thermal performance of your design.
  • To minimize EMI and EMC issues, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead to filter the power supply. Additionally, consider using a PCB layout that minimizes loop areas and uses a solid ground plane to reduce radiation.
  • For high-reliability or safety-critical applications, consider using redundant or duplicated circuits, implementing error detection and correction mechanisms, and following relevant industry standards and guidelines (e.g., IEC 61508 or DO-254). Additionally, ensure that the device is properly derated and that the system is designed to tolerate single-point failures.

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AMC1304M25DWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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