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BQ51013BYFPR - Texas Instruments

Description: WPC 1.1 Compatible Fully Integrated Wireless Power Receiver IC

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BQ51013BYFPR - Texas Instruments - PCB symbol
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PCB Footprints
BQ51013BYFPR - Texas Instruments PCB footprint - BGA - BGA - YFP(R-XBGA-N28)
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3D Models
BQ51013BYFPR - Texas Instruments - 3D model - BGA - YFP(R-XBGA-N28)
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BQ51013BYFPR Details

  • Manufacturer Part Number:

    BQ51013BYFPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • Input Voltage-Max:

    10 V

  • Input Voltage-Min:

    4 V

  • JESD-30 Code:

    R-XBGA-B28

  • JESD-609 Code:

    e1

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA28,4X7,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max (Isup):

    1500 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +2.7V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.9 mm

BQ51013BYFPR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate layer for the high-frequency signals is recommended. Keep the layout compact and symmetrical, with the BQ51013BYFPR at the center. Use a common mode choke or a ferrite bead to filter the input voltage.
  • Ensure the transmitter and receiver coils are aligned properly, and the distance between them is within the recommended range (typically 5 mm). Use a shielding material, such as copper or aluminum, to minimize electromagnetic interference.
  • The BQ51013BYFPR can transfer up to 5 W of power wirelessly, depending on the coil design, alignment, and operating frequency. However, the actual power transfer may be limited by the specific application and regulatory requirements.
  • FOD can be implemented using a combination of voltage and current sensing, along with a dedicated FOD pin on the BQ51013BYFPR. The device can detect foreign objects and adjust its operation accordingly to prevent overheating or damage.
  • The device has a maximum junction temperature of 125°C. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or a heat sink to dissipate heat. Keep the device away from other heat sources and ensure good airflow.

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BQ51013BYFPR Overview

Use the download button to access the BQ51013BYFPR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BQ510, or try a keyword search, such as Power Management Circuits

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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