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BQ77PL900DLRG4 - Texas Instruments

Description: IC BATT PROT LI-ION AFE 48-SSOP

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BQ77PL900DLRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DL (R-PDSO-G48)
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BQ77PL900DLRG4 - Texas Instruments  - 3D model - Small Outline Packages - DL (R-PDSO-G48)
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BQ77PL900DLRG4 Details

  • Manufacturer Part Number:

    BQ77PL900DLRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    GREEN, PLASTIC, SSOP-48

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY MONITOR/PROTECTOR

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    15.875 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP48,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.79 mm

  • Supply Current-Max (Isup):

    0.8 mA

  • Supply Voltage-Max (Vsup):

    50 V

  • Supply Voltage-Min (Vsup):

    7 V

  • Supply Voltage-Nom (Vsup):

    36 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.49 mm

BQ77PL900DLRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good design practices, such as keeping the power and ground planes separate, using a solid ground plane, and minimizing trace lengths and widths to reduce EMI and noise.
  • To ensure accurate voltage monitoring and control, it's crucial to follow the recommended voltage sensing and monitoring circuitry, use a high-precision voltage reference, and calibrate the device during manufacturing or production.
  • The BQ77PL900DLRG4 has a high-power density, so thermal management is critical. Ensure good airflow, use a heat sink or thermal pad, and follow the recommended thermal design guidelines to keep the junction temperature within the specified range.
  • The BQ77PL900DLRG4 has built-in fault detection and protection features, such as overvoltage, undervoltage, and overcurrent protection. Implement additional external protection circuits as needed, and ensure that the device is properly configured and calibrated for fault detection and response.
  • To ensure EMC compliance, follow good design practices, such as using a shielded enclosure, minimizing radiated emissions, and using EMI filters or chokes as needed. Additionally, ensure that the device is properly configured and calibrated for EMC compliance.

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BQ77PL900DLRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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