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DP83867ERGZR - Texas Instruments

Description: Extended temperature, robust low-latency gigabit Ethernet PHY transceiver with SGMII

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DP83867ERGZR - Texas Instruments - PCB symbol
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PCB Footprints
DP83867ERGZR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048B
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DP83867ERGZR - Texas Instruments - 3D model - Quad Flat No-Lead - RGZ0048B
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DP83867ERGZR Details

  • Manufacturer Part Number:

    DP83867ERGZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    1000000 Mbps

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

DP83867ERGZR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DP83867ERGZR datasheet, but it's also recommended to follow the guidelines in the 'High-Speed PCB Layout Guidelines' application note (SL-427) for optimal performance.
  • The DP83867ERGZR is a highly configurable device. For specific Ethernet protocol configurations, refer to the 'DP83867ERGZR Configuration and Register Programming Guide' (SWRU623) and the 'DP83867ERGZR Register Description' (SWRU624) documents.
  • The DP83867ERGZR has a maximum junction temperature of 150°C. Ensure proper thermal design and heat dissipation to prevent overheating. Refer to the 'Thermal Design Considerations' section in the datasheet for more information.
  • For troubleshooting, refer to the 'DP83867ERGZR Troubleshooting Guide' (SWRU625) and the 'DP83867ERGZR Debug and Test Guide' (SWRU626) documents. These guides provide step-by-step procedures for identifying and resolving common issues.
  • The DP83867ERGZR has multiple power management options, including power-down modes and dynamic voltage scaling. Refer to the 'Power Management' section in the datasheet for more information on how to optimize power consumption.

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DP83867ERGZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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