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DS90C383BMT/NOPB - Texas Instruments

Description: +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link-65 MHz

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DS90C383BMT/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0056A
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DS90C383BMT/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGG0056A
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DS90C383BMT/NOPB Details

  • Manufacturer Part Number:

    DS90C383BMT/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Out Swing-Min:

    0.25 V

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    50 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

DS90C383BMT/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS90C383BMT/NOPB involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the connectors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper termination, use a 100-ohm differential termination resistor at the receiver end, and a 50-ohm single-ended termination resistor at the transmitter end. Additionally, make sure to use a high-quality, low-loss PCB material and maintain a consistent impedance throughout the transmission line.
  • The maximum cable length supported by the DS90C383BMT/NOPB depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths of up to 10 meters at a data rate of 1.5 Gbps, and up to 5 meters at a data rate of 3 Gbps.
  • To troubleshoot issues with the DS90C383BMT/NOPB, use a combination of tools such as oscilloscopes, logic analyzers, and signal generators to analyze the signal quality and data transmission. Check for issues such as signal attenuation, jitter, and noise, and verify that the device is properly configured and terminated.
  • Yes, the DS90C383BMT/NOPB can be used in a multi-drop bus configuration, but it requires careful consideration of the bus topology, signal loading, and termination. It's recommended to use a star topology with a central hub and multiple branches, and to ensure that each branch is properly terminated to prevent signal reflections.

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DS90C383BMT/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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