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DS90CF383BMT/NOPB - Texas Instruments

Description: +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link-65 MHz

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DS90CF383BMT/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0056A
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DS90CF383BMT/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGG0056A
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DS90CF383BMT/NOPB Details

  • Manufacturer Part Number:

    DS90CF383BMT/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Out Swing-Min:

    0.25 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    60 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

DS90CF383BMT/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS90CF383BMT/NOPB involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the connectors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure signal integrity with the DS90CF383BMT/NOPB, it's essential to maintain a controlled impedance environment, minimize signal reflections, and use proper termination techniques. Additionally, using a signal integrity analysis tool can help identify potential issues before they become problems.
  • The maximum cable length supported by the DS90CF383BMT/NOPB depends on the specific application and the type of cable used. However, as a general rule, the device can support cable lengths of up to 10 meters at a data rate of 3.125 Gbps. Longer cable lengths may be possible at lower data rates.
  • To troubleshoot issues with the DS90CF383BMT/NOPB, start by verifying that the device is properly powered and configured. Check the input and output signals using an oscilloscope, and verify that the clock signals are stable and within the recommended frequency range. If issues persist, consult the datasheet and application notes for troubleshooting guidelines.
  • The DS90CF383BMT/NOPB is rated for operation up to 85°C, but it's essential to ensure that the device is properly cooled and that the ambient temperature is within the recommended range. Exceeding the recommended temperature range can affect the device's performance and reliability.

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DS90CF383BMT/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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