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DS90CF386MTD - Texas Instruments

Description: LVDS receiver,DS90CF386MTD TSSOP56

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DS90CF386MTD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0056A
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DS90CF386MTD - Texas Instruments  - 3D model - Small Outline Packages - DGG0056A
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DS90CF386MTD Details

  • Manufacturer Part Number:

    DS90CF386MTD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-56

  • Pin Count:

    56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e0

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Out Swing-Min:

    2.4 V

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    135 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    6.1 mm

DS90CF386MTD Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DS90CF386MTD datasheet, but it's also recommended to follow the guidelines in the 'High-Speed Layout Guidelines' application note (SLWC061) for optimal performance.
  • To ensure signal integrity, it's essential to follow proper PCB design and layout practices, such as using controlled impedance traces, minimizing signal reflections, and using termination resistors. Additionally, the DS90CF386MTD has built-in features like output pre-emphasis and input equalization to help improve signal integrity.
  • The maximum cable length supported by the DS90CF386MTD depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 10 meters at 3.125 Gbps and up to 5 meters at 6.25 Gbps. It's recommended to consult the datasheet and application notes for more detailed information.
  • The DS90CF386MTD can be configured for different data rates using the device's control pins and registers. The device supports data rates from 100 Mbps to 6.25 Gbps, and the specific configuration will depend on the application requirements. It's recommended to consult the datasheet and application notes for more detailed information on configuring the device for different data rates.
  • The power consumption of the DS90CF386MTD depends on the specific application and the device's operating mode. However, the typical power consumption is around 350 mW at 3.3 V and 250 mW at 2.5 V. It's recommended to consult the datasheet for more detailed information on power consumption and power management.

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DS90CF386MTD Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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