The recommended PCB footprint for FGH40N60SMDF-F085 is a 5x6mm pad with a 0.5mm thermal via, as specified in the onsemi application note AND9093/D.
To ensure reliable operation in high-temperature environments, it is recommended to derate the maximum junction temperature (Tj) by 5°C for every 1,000 feet of altitude above sea level, and to use a suitable thermal interface material to minimize thermal resistance.
The recommended gate drive voltage for FGH40N60SMDF-F085 is between 10V and 15V, with a gate current of 1A to 2A, to ensure reliable switching and minimize power losses.
To protect FGH40N60SMDF-F085 from ESD, it is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging, and follow proper ESD-handling procedures during assembly and testing.
The maximum allowed voltage imbalance between the drain and source pins of FGH40N60SMDF-F085 is ±5V, to prevent damage to the internal parasitic diode.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
FGH40N60SMDF-F085 Overview
Use the download button to access the FGH40N60SMDF-F085 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like FGH40,
or try a keyword search, such as IGBTs
