The maximum operating temperature range for the FQD3P50TM is -55°C to 150°C.
To ensure proper biasing, the FQD3P50TM requires a gate-source voltage (Vgs) of 10-15V and a drain-source voltage (Vds) of 50V or less. Additionally, a gate resistor (Rg) of 1-10kΩ is recommended to prevent oscillations.
For optimal thermal performance, it is recommended to use a PCB with a thermal pad and a heat sink. The device should be placed near a thermal via or a heat sink to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the PCB.
To protect the FQD3P50TM from ESD, it is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging, and follow proper handling and storage procedures. Additionally, an ESD protection diode can be added to the circuit to prevent ESD damage.
The FQD3P50TM is manufactured according to onsemi's quality and reliability standards, which include ISO 9001:2015 certification, AEC-Q101 automotive qualification, and compliance with relevant industry standards such as JEDEC and IPC.
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FQD3P50TM Overview
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