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HD3SS3212RKSR - Texas Instruments

Description: High Speed Differential Switch 2:1/1:2 MUX/DEMUX USB 3.1 3.3V T/R 20-Pin VQFN EP

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PCB Footprints
HD3SS3212RKSR - Texas Instruments PCB footprint - Other - Other - RKS0020A-1
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HD3SS3212RKSR - Texas Instruments  - 3D model - Other - RKS0020A-1
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HD3SS3212RKSR Details

  • Manufacturer Part Number:

    HD3SS3212RKSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    8000 MHz

  • Input Voltage-Max:

    4.5 V

  • JESD-30 Code:

    R-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    2

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Off-state Isolation-Nom:

    75 dB

  • On-state Resistance Match-Nom:

    0.5 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.1X.18,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.8 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

HD3SS3212RKSR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the signal traces as short as possible. Additionally, it's recommended to use a common mode filter and to decouple the power supply lines.
  • The HD3SS3212RKSR requires a 1.8V to 3.3V power supply, and it's recommended to power the device in the following sequence: VCC, then VCCIO. Additionally, it's recommended to use a 10uF capacitor on the VCC pin and a 1uF capacitor on the VCCIO pin.
  • The HD3SS3212RKSR supports data transfer rates up to 10 Gbps, making it suitable for high-speed applications such as USB 3.2 Gen 2 and DisplayPort.
  • The HD3SS3212RKSR can be configured for different applications using the device's registers. For example, to configure the device for USB 3.2 Gen 2, the USB_CFG register needs to be set to 0x01, and for DisplayPort, the DP_CFG register needs to be set to 0x02.
  • The HD3SS3212RKSR has a maximum junction temperature of 125°C, and it's recommended to keep the device temperature below 85°C for optimal performance. A thermal pad is available on the device to help dissipate heat.

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HD3SS3212RKSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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