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HD3SS3220IRNHT - Texas Instruments

Description: Texas Instruments HD3SS3220IRNHT, USB Controller, 10000Mbit/s, USB 3.1, 30-Pin WQFN

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PCB Footprints
HD3SS3220IRNHT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RNH0030A
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3D Models
HD3SS3220IRNHT - Texas Instruments  - 3D model - Quad Flat No-Lead - RNH0030A
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HD3SS3220IRNHT Details

  • Manufacturer Part Number:

    HD3SS3220IRNHT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-30

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bus Compatibility:

    I2C

  • Data Transfer Rate-Max:

    1250 MBps

  • JESD-30 Code:

    R-PQCC-N30

  • JESD-609 Code:

    e4

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

HD3SS3220IRNHT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power planes. Use a common mode filter or a ferrite bead to reduce EMI.
  • The HD3SS3220IRNHT requires a 1.8V to 3.3V power supply. Ensure that the power supply is stable and well-regulated. Power sequencing is not critical, but it's recommended to power up the VCC pin before the VCCIO pin.
  • The HD3SS3220IRNHT has a thermal pad that must be connected to a solid ground plane to dissipate heat. Use a thermal interface material (TIM) to improve heat transfer. Ensure good airflow around the device and avoid blocking the thermal pad.
  • The HD3SS3220IRNHT can be configured for USB 3.0 or USB 2.0 operation by setting the USB_SEL pin high or low, respectively. Refer to the datasheet for specific pin configurations and settings.
  • The HD3SS3220IRNHT has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is properly grounded during handling.

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HD3SS3220IRNHT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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