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HD3SS3220RNHR - Texas Instruments

Description: 10Gbps USB 3.1 Type-C 2:1 Mux with DRP Controller

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PCB Footprints
HD3SS3220RNHR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RNH0030A
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3D Models
HD3SS3220RNHR - Texas Instruments  - 3D model - Quad Flat No-Lead - RNH0030A
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HD3SS3220RNHR Details

  • Manufacturer Part Number:

    HD3SS3220RNHR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-30

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bus Compatibility:

    I2C

  • Data Transfer Rate-Max:

    1250 MBps

  • JESD-30 Code:

    R-PQCC-N30

  • JESD-609 Code:

    e4

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

HD3SS3220RNHR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-speed signals away from the power plane and use a shielded cable for the USB interface. Refer to the TI application note 'PCB Layout Guidelines for HD3SS3220RNHR' for more details.
  • The HD3SS3220RNHR requires a 1.8V core voltage and a 3.3V I/O voltage. Power sequencing is critical; power up the 1.8V core voltage first, followed by the 3.3V I/O voltage. Ensure a minimum of 10uF decoupling capacitance on each power rail.
  • The recommended termination resistors for the USB interface are 33Ω for D+ and 22Ω for D-. Calculate the values based on the transmission line impedance, cable length, and signal frequency. Refer to the USB 2.0 specification and the TI application note 'USB Termination Resistors for HD3SS3220RNHR' for more details.
  • Configure the HD3SS3220RNHR for USB 2.0 high-speed mode by setting the HS_MODE pin high. The clock signal requires a 24MHz crystal oscillator with a ±100ppm tolerance. Ensure the clock signal is stable and meets the USB 2.0 specification requirements.
  • The HD3SS3220RNHR has a maximum junction temperature of 125°C. Ensure good airflow around the device, and use a thermal pad or heat sink if necessary. Monitor the device temperature using the THERM pin and implement thermal shutdown or throttling if necessary.

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HD3SS3220RNHR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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