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LTC2990IMS#PBF - Analog Devices

Description: Quad I2C Voltage Current and Temperature Linear Technology LTC2990IMS#PBF, 14 bit Serial ADC, 4-channel Differential Input, 10-Pin MSOP

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LTC2990IMS#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS10(MSOP)
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LTC2990IMS#PBF - Analog Devices  - 3D model - Small Outline Packages - MS10(MSOP)
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LTC2990IMS#PBF Details

  • Manufacturer Part Number:

    LTC2990IMS#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1661

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.9 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC2990IMS#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC2990IMS#PBF involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing the device close to the power source. Additionally, it is recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and ensure optimal performance.
  • To ensure accurate voltage monitoring with the LTC2990IMS#PBF, it is recommended to use a high-accuracy voltage reference, such as the LTC6655, and to calibrate the device during manufacturing. Additionally, it is important to ensure that the voltage monitoring inputs are properly filtered and shielded to minimize noise and interference.
  • The maximum operating temperature range for the LTC2990IMS#PBF is -40°C to 125°C. However, it is recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • The LTC2990IMS#PBF can be interfaced with a microcontroller or FPGA using a standard I2C or SPI interface. The device provides a 7-bit or 10-bit address, allowing multiple devices to be connected to the same bus. The interface can be configured using the device's control register, and data can be read or written using the I2C or SPI protocol.
  • The power consumption of the LTC2990IMS#PBF depends on the operating mode and the frequency of the device. In normal operating mode, the device consumes approximately 1.5mA of current. In shutdown mode, the device consumes less than 1μA of current.

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LTC2990IMS#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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