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OPA3693IDBQ - Texas Instruments

Description: OPA3693IDBQ, Video Buffer ±1.75 → ±6 V, 3.5 → 12 V 16-Pin SSOP

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OPA3693IDBQ - Texas Instruments - PCB symbol
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PCB Footprints
OPA3693IDBQ - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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OPA3693IDBQ - Texas Instruments - 3D model - Small Outline Packages - DBQ0016A
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OPA3693IDBQ Details

  • Manufacturer Part Number:

    OPA3693IDBQ

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    VIDEO AMPLIFIER

  • Gain:

    31.8 dB

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    41 mA

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    1.9 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

OPA3693IDBQ Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA3693IDBQ involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, ensure that the gain resistors are properly matched, and the feedback network is properly compensated. Also, avoid using long input traces and keep the input impedance low to minimize oscillations.
  • The maximum power dissipation of OPA3693IDBQ is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature.
  • Yes, OPA3693IDBQ is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure that the device is properly heat-sinked and follow the recommended thermal design guidelines.
  • To protect OPA3693IDBQ from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use EMI filters or shielding on the input and output lines. Also, ensure that the PCB layout is designed to minimize radiation and susceptibility to EMI.

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OPA3693IDBQ Overview

Use the download button to access the OPA3693IDBQ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like OPA36, or try a keyword search, such as Audio/Video Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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