EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482; X3.277
JESD-30 Code:
R-PDSO-G16
JESD-609 Code:
e4
Length:
6.2 mm
Moisture Sensitivity Level:
1
Number of Functions:
3
Number of Terminals:
16
Operating Temperature-Max:
70 °C
Out Swing-Min:
1 V
Output Characteristics:
DIFFERENTIAL
Output Low Current-Max:
0.008 A
Output Polarity:
COMPLEMENTARY
Package Body Material:
PLASTIC/EPOXY
Package Code:
SSOP
Package Equivalence Code:
SSOP16,.3
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Receive Delay-Max:
16 ns
Receiver Number of Bits:
3
Seated Height-Max:
2 mm
Supply Current-Max:
20 mA
Supply Voltage-Max:
5.25 V
Supply Voltage-Min:
4.75 V
Supply Voltage-Nom:
5 V
Supply Voltage1-Max:
5.25 V
Supply Voltage1-Min:
4.75 V
Supply Voltage1-Nom:
5 V
Surface Mount:
YES
Technology:
BICMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transmit Delay-Max:
12 ns
Width:
5.3 mm
SN75LBC170DBR Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
The SN75LBC170DBR has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour can be used to connect the thermal pad to the thermal plane. Additionally, the device can be mounted on a heat sink or a metal core PCB to further improve thermal dissipation.
The maximum cable length supported by the SN75LBC170DBR depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 100 Mbps. For longer cable lengths, repeaters or active cables may be required.
The SN75LBC170DBR is designed for point-to-point applications, but it can also be used in multi-point configurations with the use of hubs or switches. However, the device's performance and reliability may be affected in multi-point configurations, and additional components may be required to ensure signal integrity.
The SN75LBC170DBR has an ESD protection level of ±2 kV human-body model (HBM) and ±1 kV charged-device model (CDM) on the transmitter and receiver pins. This level of protection is sufficient for most industrial and commercial applications, but additional ESD protection may be required in harsh environments.
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SN75LBC170DBR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
