EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482; X3.277
JESD-30 Code:
R-PDSO-G16
JESD-609 Code:
e4
Length:
6.2 mm
Moisture Sensitivity Level:
1
Number of Functions:
3
Number of Terminals:
16
Operating Temperature-Max:
70 °C
Out Swing-Min:
1 V
Output Characteristics:
TOTEM-POLE
Output Low Current-Max:
0.008 A
Output Polarity:
TRUE
Package Body Material:
PLASTIC/EPOXY
Package Code:
SSOP
Package Equivalence Code:
SSOP16,.3
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Receive Delay-Max:
16 ns
Receiver Number of Bits:
3
Seated Height-Max:
2 mm
Supply Current-Max:
20 mA
Supply Voltage-Max:
5.25 V
Supply Voltage-Min:
4.75 V
Supply Voltage-Nom:
5 V
Supply Voltage1-Max:
5.25 V
Supply Voltage1-Min:
4.75 V
Supply Voltage1-Nom:
5 V
Surface Mount:
YES
Technology:
BICMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
NICKEL PALLADIUM GOLD
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transmit Delay-Max:
12 ns
Width:
5.3 mm
SN75LBC170DBRG4 Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The SN75LBC170DBRG4 has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour connected to a ground plane can be used to dissipate heat. Additionally, the device's thermal resistance can be reduced by using a heat sink or a thermal interface material.
The maximum cable length supported by the SN75LBC170DBRG4 depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 100 Mbps. For longer cable lengths, repeaters or active cables may be required.
Texas Instruments provides a troubleshooting guide in the application note SLVAE03, which covers common issues such as signal integrity problems, power supply issues, and thermal-related issues. Additionally, the device's built-in diagnostic features, such as the fault detection and reporting mechanism, can be used to identify and troubleshoot issues.
The recommended power supply decoupling capacitors for the SN75LBC170DBRG4 are 0.1 μF to 1 μF ceramic capacitors with a voltage rating of 10 V to 25 V, placed as close as possible to the device's power pins. Additionally, a 10 μF to 22 μF bulk capacitor can be used to filter out low-frequency noise.
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SN75LBC170DBRG4 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
