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TLV2556IPWG4 - Texas Instruments

Description: 11-Channel Single ADC SAR 200ksps 12-bit Serial 20-Pin TSSOP Tube

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TLV2556IPWG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW(R-PDSO-G20) 2021
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TLV2556IPWG4 - Texas Instruments  - 3D model - Small Outline Packages - PW(R-PDSO-G20) 2021
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TLV2556IPWG4 Details

  • Manufacturer Part Number:

    TLV2556IPWG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Input Voltage-Max:

    5.5 V

  • Analog Input Voltage-Min:

    2.7 V

  • Conversion Time-Max:

    5.54 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    11

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.2 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TLV2556IPWG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended layout and routing guide in the TLV2556IPWG4 datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as keeping the analog and digital grounds separate, using a solid ground plane, and minimizing trace lengths and loops.
  • The TLV2556IPWG4 has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a thermal pad on the PCB can be used to dissipate heat. Additionally, ensuring good airflow around the device and using a heat sink if necessary can also help with thermal dissipation.
  • The recommended input capacitance is typically in the range of 1-10uF, and the recommended output capacitance is typically in the range of 1-22uF. However, the optimal capacitance values depend on the specific application and should be determined through simulation and testing.
  • To ensure stability, it's recommended to follow the datasheet guidelines for component selection, PCB layout, and routing. Additionally, using a compensation capacitor between the output and the inverting input can help to stabilize the device. It's also recommended to simulate the circuit using a SPICE model and to test the circuit in a prototype before mass production.
  • The TLV2556IPWG4 has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade at higher temperatures, so it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance.

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TLV2556IPWG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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