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TLV2556MPWREP - Texas Instruments

Description: Enhanced Product 12-Bit, 200 KSPS, 11 Channel, Low Power, Serial ADC with Internal Reference

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TLV2556MPWREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0020A
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TLV2556MPWREP - Texas Instruments  - 3D model - Small Outline Packages - PW0020A
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TLV2556MPWREP Details

  • Manufacturer Part Number:

    TLV2556MPWREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Input Voltage-Max:

    5.5 V

  • Analog Input Voltage-Min:

    2.7 V

  • Conversion Time-Max:

    6.46 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    11

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.2 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    2.4 mA

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TLV2556MPWREP Frequently Asked Questions (FAQs)

  • A good PCB layout for TLV2556MPWREP involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper powering and decoupling, use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) between the VCC and GND pins, and a smaller capacitor (e.g., 100nF ceramic) between the AVCC and AGND pins. Place these capacitors as close to the device as possible.
  • The TLV2556MPWREP can operate with clock frequencies up to 3.6 MHz. However, the maximum clock frequency may vary depending on the specific application and the quality of the clock signal. It's recommended to consult the datasheet and application notes for more information.
  • To ensure accurate conversions, it's essential to properly filter and condition the analog input signals. Use a low-pass filter to remove high-frequency noise, and consider using a voltage divider or an op-amp to adjust the signal amplitude and impedance to match the TLV2556MPWREP's input requirements.
  • The TLV2556MPWREP has an internal calibration mechanism. To calibrate the device, apply a known input voltage to the analog input pins, and then use the device's calibration registers to adjust the internal offset and gain. Consult the datasheet and application notes for more information on the calibration procedure.

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TLV2556MPWREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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