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TPA3007D1PWR - Texas Instruments

Description: 6.5-W Mono Class-D Audio Power Amplifier (TPA3007)

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TPA3007D1PWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0024A
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TPA3007D1PWR - Texas Instruments  - 3D model - Small Outline Packages - PW0024A
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TPA3007D1PWR Details

  • Manufacturer Part Number:

    TPA3007D1PWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    6.5 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TPA3007D1PWR Frequently Asked Questions (FAQs)

  • According to TI's application notes, a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed close to the power pins, are recommended for power supply decoupling.
  • TI recommends a 4-layer PCB with a solid ground plane, and to keep the audio signal traces away from the power supply and ground planes. Additionally, use a star-grounding scheme and avoid routing audio signals under the device.
  • The maximum power dissipation of the TPA3007D1PWR is 15W, but this can be limited by the thermal resistance of the package and the PCB. Proper thermal design and heat sinking are crucial to ensure reliable operation.
  • Yes, the TPA3007D1PWR can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the power supply, PCB layout, and thermal design to ensure reliable operation.
  • TI recommends using a voltage supervisor or a power-on reset circuit to protect the device from overvoltage and undervoltage conditions. Additionally, a voltage regulator with overcurrent protection can be used to regulate the power supply.

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TPA3007D1PWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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