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TPA311DGNG4 - Texas Instruments

Description: Audio Amplifiers 0.35-W Mono Audio Power Amplifier

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TPA311DGNG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)
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TPA311DGNG4 - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)
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TPA311DGNG4 Details

  • Manufacturer Part Number:

    TPA311DGNG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    GREEN, PLASTIC, MSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Bandwidth-Nom:

    10 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.5%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.7 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA311DGNG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout for the TPA311DGNG4 in the application note SLAA883. It suggests using a 4-layer PCB with a solid ground plane, placing the device near the edge of the board, and using thermal vias to dissipate heat.
  • The input capacitor values depend on the input signal frequency, amplitude, and source impedance. A general rule of thumb is to use a capacitor with a value between 1uF to 10uF, and a voltage rating that exceeds the maximum input voltage. TI also provides a capacitor selection guide in the datasheet.
  • The maximum power dissipation of the TPA311DGNG4 is dependent on the ambient temperature, package thermal resistance, and the output power. TI provides a power dissipation calculator in the datasheet, and also recommends using the PowerPAD thermally enhanced package to reduce thermal resistance.
  • The TPA311DGNG4 has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, external protection circuits may still be necessary depending on the application. TI recommends using a voltage supervisor or a power supply monitor to detect overvoltage and undervoltage conditions.
  • The recommended output filter configuration for the TPA311DGNG4 is a 2nd-order low-pass filter with a cutoff frequency between 50kHz to 100kHz. TI provides a filter design guide in the application note SLAA884.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA311DGNR Texas Instruments

Audio Amplifier, 0.35W, 1 Channel(s), 1 Func, CMOS, PDSO8