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TPA6111A2DGN - Texas Instruments

Description: 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4880 and LM4881

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TPA6111A2DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOIC
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TPA6111A2DGN Details

  • Manufacturer Part Number:

    TPA6111A2DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    20 dB

  • Harmonic Distortion:

    0.1%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.15 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    3.2 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA6111A2DGN Frequently Asked Questions (FAQs)

  • According to TI's application notes, a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor is recommended for power supply decoupling, placed as close to the device as possible.
  • TI recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, the power supply traces should be routed away from the input and output traces to minimize noise coupling.
  • The maximum power dissipation of the TPA6111A2DGN is 2.5W, and it is recommended to keep the junction temperature below 150°C to ensure reliable operation.
  • Yes, the TPA6111A2DGN can be used in a bridged configuration, but it requires additional external components and careful PCB layout to ensure proper operation and to minimize distortion.
  • TI recommends using external ESD protection devices, such as TVS diodes, and overvoltage protection circuits to protect the device from voltage transients and ESD events.

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TPA6111A2DGN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA6111A2DGNRG4 Texas Instruments

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Part Image TPA6111A2DGNG4 Texas Instruments

Audio Amplifier, 0.15W, 2 Channel(s), 1 Func, CMOS, PDSO8