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TPA6111A2DGNR - Texas Instruments

Description: Audio Amplifiers Stereo Headphone Pin Compat

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TPA6111A2DGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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TPA6111A2DGNR - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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TPA6111A2DGNR Details

  • Manufacturer Part Number:

    TPA6111A2DGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    20 dB

  • Harmonic Distortion:

    0.1%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.15 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    3.2 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA6111A2DGNR Frequently Asked Questions (FAQs)

  • According to TI's application notes, a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor is recommended for power supply decoupling, placed as close to the device as possible.
  • The gain setting depends on the specific application and desired output power. TI recommends using the gain setting equations provided in the datasheet to determine the optimal gain setting for your specific application.
  • The maximum power dissipation for the TPA6111A2DGNR is 2.5W. Exceeding this limit can cause the device to overheat and potentially fail.
  • Yes, the TPA6111A2DGNR can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the power supply and output stage design to ensure proper operation.
  • TI recommends a 4-layer PCB with a solid ground plane and a separate power plane for the amplifier. The input and output traces should be kept short and away from noise sources.

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TPA6111A2DGNR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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