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TPA6205A1DGN - Texas Instruments

Description: Texas Instruments,TPA6205A1DGN,IC,Audio Texas Instruments TPA6205A1DGN Audio Amplifier IC, Class-AB Mono -70dB, 8-Pin MSOP

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TPA6205A1DGN - Texas Instruments - PCB symbol
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TPA6205A1DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)_1
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TPA6205A1DGN - Texas Instruments - 3D model - Small Outline Packages - DGN (S-PDSO-G8)_1
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TPA6205A1DGN Details

  • Manufacturer Part Number:

    TPA6205A1DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    104 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    1.25 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA6205A1DGN Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPA6205A1DGN involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • The gain setting depends on the input signal level and the desired output power. A higher gain setting can provide more output power, but may also increase noise and distortion. TI provides a gain calculation formula in the datasheet to help determine the optimal gain setting.
  • The maximum power dissipation of the TPA6205A1DGN is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a thermal derating curve in the datasheet to help determine the maximum power dissipation for a given application.
  • To filter out noise and EMI, use a combination of passive components such as capacitors, inductors, and resistors to filter the input and output signals. Additionally, use shielding and grounding techniques to minimize electromagnetic interference.
  • TI recommends using a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, placed as close as possible to the power pins of the device. This helps to filter out noise and ripple on the power supply.

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TPA6205A1DGN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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