DEVICE FEATURES SHUTDOWN MODE FOR POWER SENSITIVE APPLICATIONS
Bandwidth-Nom:
20 kHz
Consumer IC Type:
AUDIO AMPLIFIER
Harmonic Distortion:
0.5%
JESD-30 Code:
R-PDSO-G8
JESD-609 Code:
e4
Length:
4.9 mm
Moisture Sensitivity Level:
1
Number of Channels:
1
Number of Functions:
1
Number of Terminals:
8
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Power-Nom:
0.7 W
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP8,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.75 mm
Supply Current-Max:
2.5 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
2.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3.9 mm
TPA751DR Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the TPA751DR evaluation module documentation, which includes guidelines for component placement, trace routing, and thermal management to ensure optimal performance and thermal dissipation.
The input capacitor selection depends on the input voltage, frequency, and ripple current requirements. A general guideline is to choose a capacitor with a voltage rating of at least 2x the maximum input voltage, and a capacitance value that meets the ripple current requirements. TI also provides a capacitor selection guide in the datasheet.
The maximum power dissipation of the TPA751DR depends on the ambient temperature, thermal resistance, and package type. According to the datasheet, the maximum power dissipation is 2.5W for the DRC package and 1.5W for the DRV package. However, it's essential to perform thermal calculations and consider derating factors to ensure safe operation.
The TPA751DR is rated for operation up to 125°C, but it's essential to consider the thermal management and derating factors when operating in high-temperature environments. TI provides thermal derating curves in the datasheet to help designers estimate the maximum power dissipation at elevated temperatures.
TI provides a troubleshooting guide in the datasheet and application notes, which covers common issues and their solutions. Additionally, designers can use simulation tools and Spice models to analyze and debug their designs. It's also recommended to consult with TI's technical support team for specific guidance.
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TPA751DR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
