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TPS3606-33DGS - Texas Instruments

Description: Battery-Backup Supervisor for Low Power Processor

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TPS3606-33DGS - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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TPS3606-33DGS - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
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TPS3606-33DGS Details

  • Manufacturer Part Number:

    TPS3606-33DGS

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    BATTERY BACKUP SUPERVISOR

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.04 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.93V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPS3606-33DGS Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to have a solid ground plane on the PCB, and to place the device near a thermal pad or a heat sink. Additionally, ensure that the PCB layout allows for good airflow around the device.
  • To ensure proper power-on and power-off, it is recommended to use a soft-start circuit to limit the inrush current, and to use a power-on reset (POR) circuit to ensure the device is fully powered on before enabling the output.
  • To ensure EMI and EMC compliance, it is recommended to use a shielded enclosure, to keep the device and PCB layout as compact as possible, and to use EMI filters or common-mode chokes on the input and output lines.
  • To handle overvoltage and undervoltage conditions, it is recommended to use a voltage supervisor or a reset IC to monitor the input voltage and reset the device if it falls outside the recommended operating range.
  • For high-temperature applications, it is recommended to use a heat sink or thermal pad, and to ensure good airflow around the device. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature and take corrective action if necessary.

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TPS3606-33DGS Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPS3606-33DGSR Texas Instruments

Fixed, 1 Channel, +2.93V, PDSO10

Part Image TPS3606-33DGSRG4 Texas Instruments

BATTERY BACKUP SUPERVISOR, Fixed, 1 Channel, +2.93V, PDSO10