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TSB12LV01BIPZTEP - Texas Instruments

Description: 1394 Interface IC Mil Enh Hi Perf 1394 3.3V Link Layer

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TSB12LV01BIPZTEP - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PZT (S-PQFP-G100)
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TSB12LV01BIPZTEP - Texas Instruments  - 3D model - Quad Flat Packages - PZT (S-PQFP-G100)
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TSB12LV01BIPZTEP Details

  • Manufacturer Part Number:

    TSB12LV01BIPZTEP

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    TQFP-100

  • Pin Count:

    100

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 5V SUPPLY

  • Address Bus Width:

    8

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    49.152 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Transfer Rate-Max:

    50 MBps

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

TSB12LV01BIPZTEP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVA883, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • The TSB12LV01BIPZTEP has a thermal pad that must be connected to a solid ground plane to dissipate heat. A thermal via array or a thermal pad connected to a heat sink can be used to improve thermal performance. Additionally, ensuring good airflow and using thermal interface materials can help reduce junction temperature.
  • The maximum cable length supported by TSB12LV01BIPZTEP depends on the specific application and the type of cable used. However, as a general guideline, Texas Instruments recommends keeping the cable length below 3 meters to ensure reliable operation. Longer cable lengths may require additional signal conditioning or repeaters.
  • Yes, TSB12LV01BIPZTEP is AEC-Q100 qualified and meets the requirements for automotive applications. Additionally, it is designed to meet the requirements of industrial standards such as IEC 61000-4-2 and IEC 61000-4-5. However, it is recommended to consult the datasheet and application notes to ensure compliance with specific standards and regulations.
  • Texas Instruments provides a troubleshooting guide in the application note SLVA884, which includes steps to identify and resolve common issues such as signal integrity problems, power supply issues, and thermal management issues. Additionally, using oscilloscopes and logic analyzers can help debug and identify issues in the design.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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