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XCKU115-2FLVB2104E - AMD

Description: IC FPGA 702 I/O 2104FCBGA

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XCKU115-2FLVB2104E - AMD PCB footprint - BGA - BGA - FLVB2104
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XCKU115-2FLVB2104E - AMD  - 3D model - BGA - FLVB2104
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XCKU115-2FLVB2104E Details

  • Manufacturer Part Number:

    XCKU115-2FLVB2104E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-2104

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2104

  • JESD-609 Code:

    e1

  • Length:

    47.5 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    5520

  • Number of Inputs:

    832

  • Number of Logic Cells:

    1451100

  • Number of Outputs:

    832

  • Number of Terminals:

    2104

  • Operating Temperature-Max:

    100 °C

  • Organization:

    5520 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2104,46X46,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.11 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    47.5 mm

XCKU115-2FLVB2104E Frequently Asked Questions (FAQs)

  • The recommended PCB layout and stackup for the XCKU115-2FLVB2104E can be found in the Xilinx PCB Design Guide (UG583) and the Xilinx FPGAs PCB Design and Signal Integrity Guidelines (UG583). These guides provide detailed information on layer stackup, trace routing, and decoupling capacitor placement.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption based on your design. Then, implement power-saving techniques such as clock gating, dynamic voltage and frequency scaling, and using low-power modes. Additionally, consider using the FPGA's built-in power management features, such as the Power Management Controller (PMC).
  • The XCKU115-2FLVB2104E has a maximum junction temperature of 100°C. To manage thermal performance, ensure good airflow around the device, use a heat sink or thermal interface material, and implement thermal monitoring and shutdown features using the FPGA's built-in thermal sensors and the Power Management Controller (PMC).
  • To ensure signal integrity and reduce EMI, follow the Xilinx PCB Design and Signal Integrity Guidelines (UG583). Implement proper signal routing, use differential signaling, and add decoupling capacitors to reduce noise. Additionally, use the FPGA's built-in features, such as the Signal Integrity Wizard, to optimize signal routing and reduce EMI.
  • The recommended design flow for the XCKU115-2FLVB2104E involves using the Xilinx Vivado Design Suite, which includes tools for design entry, synthesis, implementation, and verification. Additionally, use the Xilinx Software Development Kit (SDK) for software development and the Xilinx Vivado High-Level Synthesis (HLS) tool for C/C++/SystemC-based design.

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XCKU115-2FLVB2104E Overview

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Part Image XCKU115-2FLVA2104E AMD

Field Programmable Gate Array, 5520 CLBs, 1451100-Cell, PBGA2104

Part Image XCKU115-2FLVB2104E AMD Xilinx

Field Programmable Gate Array, 5520 CLBs, 1451100-Cell, PBGA2104

Part Image XCKU115-2FLVA2104I AMD Xilinx

Field Programmable Gate Array, 5520 CLBs, 1451100-Cell, PBGA2104

Part Image XCKU115-2FLVA2104E AMD Xilinx

Field Programmable Gate Array, 5520 CLBs, 1451100-Cell, PBGA2104

Part Image XCKU115-2FLVB2104I AMD Xilinx

Field Programmable Gate Array, 5520 CLBs, 1451100-Cell, PBGA2104

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