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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W631GG8MB11A Winbond This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V\r\n Double Data Rate architecture: two data transfers per clock cycle\r\n Eight internal banks for concurrent operation\r\n 8 bit prefetch architecture\r\n CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14\r\n Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)\r\n Programmable read burst ordering: interleaved or nibble sequential\r\n Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB11A	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8NB11K Winbond This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V\r\n Double Data Rate architecture: two data transfers per clock cycle\r\n Eight internal banks for concurrent operation\r\n 8 bit prefetch architecture\r\n CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14\r\n Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)\r\n Programmable read burst ordering: interleaved or nibble sequential\r\n Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG8NB11K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB09W Winbond This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	 Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR)\r\n Precharged Power Down and Active Power Down\r\n Data masks (DM) for write data\r\n Programmable CAS Write Latency (CWL) per operating frequency\r\n Write Latency WL = AL + CWL\r\n Multi purpose register (MPR) for readout a predefined system timing calibration bit sequence\r\n System level timing calibration support via write leveling and MPR read pattern\r\n ZQ Calibration for output driver and ODT using external reference r	BGA	W632GG6MB09W	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8NB15A Winbond This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V\r\n Double Data Rate architecture: two data transfers per clock cycle\r\n Eight internal banks for concurrent operation\r\n 8 bit prefetch architecture\r\n CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14\r\n Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)\r\n Programmable read burst ordering: interleaved or nibble sequential\r\n Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG8NB15A	3D model available Symbol and footprint available 3	1 Download Model

	W631GG6NB15A Winbond This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V\r\n⚫ Double Data Rate architecture: two data transfers per clock cycle\r\n⚫ Eight internal banks for concurrent operation\r\n⚫ 8 bit prefetch architecture\r\n⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14\r\n⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)\r\n⚫ Programmable read burst ordering: interleaved or nibble sequential\r\n⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6NB15A	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB12W Winbond This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V\r\n Double Data Rate architecture: two data transfers per clock cycle\r\n Eight internal banks for concurrent operation\r\n 8 bit prefetch architecture\r\n CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14\r\n Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)\r\n Programmable read burst ordering: interleaved or nibble sequential\r\n Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB12W	3D model available Symbol and footprint available 3	1 Download Model
	UCC21738QDWRQ1 Texas Instruments	1	Optically Isolated Gate Drivers Automotive 10-A single-channel isolated gate driver for SiC/IGBT, active short-circuit protection 16-SOIC -40 to 125\r\n5.7-kVRMS single channel isolated gate driver\r\n• AEC-Q100 Qualified with the following results:\r\n– Device temperature grade 1: -40°C to +125°C\r\nambient operating temperature range\r\n– Device HBM ESD classification level 3A\r\n– Device CDM ESD classification level C6\r\n• Functional Safety Quality-Managed\r\n– Documentation available to aid functional safety\r\nsystem d	Small Outline Packages	UCC21738QDWRQ1	3D model available Symbol and footprint available 3	1 Download Model
	1963492 Phoenix Contact	1	PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 9, Number of rows: 1, Number of positions per row: 9, number of connections: 9, product range: MC 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, Stecksystem: MICRO COMBICON - FK-MC 0,5, Locking: without, type of packaging: packed in cardboard, User information and d	Other	1963492	3D model available Symbol and footprint available 3	1 Download Model
	745057-3 TE Connectivity	1	Body Features: Insert Material Brass \| Mating Retention Feature Material Brass \| Primary Product Color Black \| Connector Profile Standard \| Configuration Features: Number of Positions 15 \| PCB Mount Orientation Vertical \| Number of Rows 2 \| Contact Features: Contact Underplating Material Nickel \| Contact Current Rating (Max) 6 AMP \| Contact Base Material Phosphor Bronze \| Contact Mating Area Plating Material Gold Flash \| Contact Shape & Form Round \| PCB Contact Termination Area Plating Material Tin-Lead \| D	Other	745057-3	3D model available Symbol and footprint available 3	1 Download Model
	ZL2006ALNFT1 Renesas Electronics	1	The ZL2006 is a digital DC-DC controller with integrated MOSFET drivers. Current sharing allows multiple devices to be connected in parallel to source loads with very high current demands. Adaptive performance optimization algorithms improve power conversion efficiency across the entire load range. Zilker Labs Digital-DC™ technology enables a blend of power conversion performance and power management features. The ZL2006 is designed to be a flexible building block for DC power and can be easily adapted to d	Quad Flat No-Lead	ZL2006ALNFT1	3D model available Symbol and footprint available 3	1 Download Model
	SMLJ13A-TP MCC	1	For Surface Mount Application in Order to Optimize Board Space\r\n• Built-in Strain Relief\r\n• Glass Passivated Junction\r\n• For Bidirectional Devices Add “C” To The Suffix of\r\nThe Part Number: i.e.SMLJ5.0CA for 5% Tolerance\r\n• Excellent Clamping Capability\r\n• Repetition Rate(duty cycle):0.5%\r\n• Fast Response Time: Typical Less Than 1ps From 0V to BV Min\r\n• Typical ID Less than 1μA Above 10V\r\n• ESD Protected up to 16KV (HBM)\r\n• High Temperature Soldering: 260°C/10 Seconds at Terminals\r\n• Halogen Free. “Green” D	Diodes Moulded	SMLJ13A-TP	3D model available Symbol and footprint available 3	1 Download Model
	HD1-15530-8 Renesas Electronics	1	The Intersil HD-15530 is a high performance CMOS device intended to service the requirements of MlL-STD-1553 and similar Manchester II encoded, time division multiplexed serial data protocols. This LSI chip is divided into two sections, an Encoder and a Decoder. These sections operate completely independent of each other, except for the Master Reset functions. This circuit meets many of the requirements of MIL-STD- 1553. The Encoder produces the sync pulse and the parity bit as well as the encoding of the d	Ceramic Dual-In-Line Packages	HD1-15530-8	3D model available Symbol and footprint available 3	1 Download Model
	MPC9448AC Renesas Electronics	1	The MPC9448 is specifically designed to distribute LVCMOS compatible clock signals up to a frequency of 350 MHz. Each output provides a precise copy of the input signal with a near zero skew. The outputs buffers support driving of 50Ω terminated transmission lines on the incident edge. Each output is capable of driving either one parallel terminated or two series terminated transmission lines. Two selectable, independent clock inputs are available, providing support of LVCMOS and differential LVPECL clock d	Quad Flat Packages	MPC9448AC	3D model available Symbol and footprint available 3	1 Download Model
	874003AG-02LF Renesas Electronics	1	The 874003-02 is a high performance Differential-to- LVDS Jitter Attenuator designed for use in PCI Express systems. In some PCI Express systems, such as those found in desktop PCs, the PCI Express clocks are generated from a low bandwidth, high phase noise PLL frequency synthesizer. In these systems, a jitter attenuator may be required to attenuate high frequency random and deterministic jitter components from the PLL synthesizer and from the system board. The 874003-02 has a bandwidth of 400kHz which is d	Small Outline Packages	874003AG-02LF	3D model available Symbol and footprint available 3	1 Download Model
	5106015-1 TE Connectivity	1	Body Features: Primary Product Color Gray \| Configuration Features: PCB Mount Orientation Right Angle \| Rows Loaded A \| Number of Columns 22 \| Backplane Architecture Mezzanine \| Number of Positions 110 \| Rows Loaded E \| Rows Loaded C \| Rows Loaded B \| Number of Rows 5 \| Rows Loaded D \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Contact Base Material Phosphor Bronze \| CompactPCI Designation None \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating	Other	5106015-1	3D model available Symbol and footprint available 3	1 Download Model

	5646357-1 TE Connectivity	1	Body Features: Primary Product Color Gray \| Configuration Features: Backplane Architecture Mezzanine \| Rows Loaded A \| Number of Rows 10 \| Rows Loaded H \| Rows Loaded E \| PCB Mount Orientation Vertical \| Rows Loaded B \| Rows Loaded Z \| Rows Loaded D \| Rows Loaded I \| Number of Signal Positions 200 \| Rows Loaded C \| Number of Columns 25 \| Number of Positions 250 \| Rows Loaded F \| Contact Features: Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) 1.5 AMP \| PCB Contact Termination Area	Other	5646357-1	3D model available Symbol and footprint available 3	1 Download Model
	5646534-1 TE Connectivity	1	Body Features: Primary Product Color Gray \| Configuration Features: Rows Loaded F \| Rows Loaded Z \| Number of Rows 7 \| Backplane Architecture Mezzanine \| Rows Loaded B \| Number of Columns 22 \| Rows Loaded E \| Number of Positions 146 \| Number of Signal Positions 110 \| PCB Mount Orientation Vertical \| Rows Loaded A \| Rows Loaded C \| Number of Signal Positions 125 \| Rows Loaded D \| Contact Features: Contact Mating Area Length 6.75 MM \| Contact Mating Area Length 8.25 MM \| Contact Current Rating (Max) 1.5 AMP \|	Other	5646534-1	3D model available Symbol and footprint available 3	1 Download Model
	85356AMILFT Renesas Electronics	1	The 85356I is a dual 2:1 Differential-to-LVPECL Multiplexer. The device has both common select and individual select inputs. When COM_SEL is logic High, the CLKxx input pairs will be passed to the output. When COM_SEL is logic Low, the output is determined by the setting of the SEL0 pin for channel 0 and the SEL1 pin for Channel 1. The differential input has a common mode range that can accept most differential input types such as LVPECL, LVDS, LVHSTL, SSTL, and HCSL. The 85356I can therefore be used as a d	Small Outline Packages	85356AMILFT	3D model available Symbol and footprint available 3	1 Download Model
	DTF15-12PD TE Connectivity	1	Body Features: Connector & Keying Code D \| Primary Product Color Brown \| Configuration Features: Number of Signal Positions 12 \| Number of Positions 12 \| Number of Rows 2 \| Number of Sections 1 \| PCB Mount Orientation Vertical \| Contact Features: Mating Pin Diameter 1.59 MM \| Contact Mating Area Plating Material Tin \| Mating Pin Diameter .063 INCH \| Contact Type Pin \| Contact Size Size 16 \| Contact Current Rating (Max) 13 AMP \| Dimensions: Profile Height from PCB 34.98 MM \| Profile Height from PCB 1.377 INC	Other	DTF15-12PD	3D model available Symbol and footprint available 3	1 Download Model
	CAS-D20B Nidec Copal	1	Slide Switch SPDT x 2 Surface Mount	Other	CAS-D20B	3D model not available Symbol and footprint available 2	1 Download Model
	CAS-D20B1 Nidec Copal	1	SWITCH SLIDE SPDTX2 100MA 6V	Other	CAS-D20B1	3D model not available Symbol and footprint available 2	1 Download Model
	ECASD91A107M010K00 Murata Electronics	1	Aluminum Organic Polymer Capacitors 100uF 10volts 4.2mm ESR 10mOhms	Capacitor Moulded Polarised	ECASD91A107M010K00	3D model available Symbol and footprint available 3	1 Download Model
	ECASD31E106M040KH0 Murata Electronics	1	10 µF 25 V Aluminum - Polymer Capacitors 2917 (7343 Metric) 40mOhm 1000 Hrs @ 125°C	Other	ECASD31E106M040KH0	3D model available Symbol and footprint available 3	1 Download Model
	ECASD61A157M010KA0 Murata Electronics	1	Polymer Aluminum Electrolytic Capacitors/General Purpose	Other	ECASD61A157M010KA0	3D model available Symbol and footprint available 3	1 Download Model
	ECASD41E106M040KH0 Murata Electronics	1	10 µF 25 V Aluminum - Polymer Capacitors 2917 (7343 Metric) 40mOhm 1000 Hrs @ 125°C	Other	ECASD41E106M040KH0	3D model available Symbol and footprint available 3	1 Download Model
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