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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	CKG57NX7R2A225M500JJ TDK	1	Multilayer Ceramic Capacitors MLCC - SMD/SMT CKG 2220 100V 2.2uF 20% T:5mm AEC-Q200	Capacitor Chip Non-polarised	CKG57NX7R2A225M500JJ	3D model available Symbol and footprint available 3	1 Download Model
	C1825C225M5RACTM Yageo Group	1	SMD Comm X7R, Ceramic, 2.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 454.5 MOhms, 240 mg, 1825, 4.5mm, 6.4mm, 1.5mm, 0.6mm, 1000, 78 Weeks, 80	Other	C1825C225M5RACTM	3D model available Symbol and footprint available 3	1 Download Model
	C326C125M5N5TA Yageo Group	1	"GoldMax, Commercial Standard"	Other	C326C125M5N5TA	3D model available Symbol and footprint available 3	1 Download Model
	C1206C225M5RECAUTO Yageo Group	1	SMD, MLCC, Temperature Stable, Electro Static Discharge, Automotive Grade	Other	C1206C225M5RECAUTO	3D model available Symbol and footprint available 3	1 Download Model

	W25M512JWCAM Winbond	1	 New Family of SpiFlash® Memories– W25M512JW-IQ: 2 x 256M-bit (2 x 32MByte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 52MB/s continuous data transfer rate– More than 100,000 Program/Erase cycles– More than 20-year data retention	BGA	W25M512JWCAM	3D model available Symbol and footprint available 3	1 Download Model
	NC7SZ125M5X onsemi	1	Proprietary Noise/EMI Reduction Circuitry ; Broad VCC Operating Range: 1.65V to 5.5V ; High Output Drive: ±24mA at 3V VCC ; Power Down High-Impedance Inputs/Outputs ; Space-Saving SOT23 and SC70 Packages; Matches Performance of LCX Operated at 3.3V VCC ; Over-Voltage Tolerance Inputs Facilitate 5V to 3V Translation ; Ultra-High Speed: tPD 2.6ns (Typical) into 50pF at 5V VCC ; Ultra-Small MicroPak™ Packages	SOT23 (5-Pin)	NC7SZ125M5X	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWFIQ Winbond	1	 New Family of SpiFlash® Memories– W25M512JW-IQ: 2 x 256M-bit (2 x 32MByte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 52MB/s continuous data transfer rate– More than 100,000 Program/Erase cycles– More than 20-year data retention	Small Outline Packages	W25M512JWFIQ	3D model available Symbol and footprint available 3	1 Download Model
	C2225C225M5RACTU Yageo Group	1	SMD, MLCC, Temperature Stable, Class II	Other	C2225C225M5RACTU	3D model available Symbol and footprint available 3	1 Download Model
	C1206C225M5RECAUTO7210 Yageo Group	1	ESD SMD Auto X7R, Ceramic, 2.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Electro Static Discharge, Automotive Grade, 2.5 % , 227.3 MOhms, 41 mg, 1206, 3.2mm, 1.6mm, 1.6mm, 0.5mm, 8000, 78 Weeks, 80	Capacitor Chip Non-polarised	C1206C225M5RECAUTO7210	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWCIQ Winbond	1	 New Family of SpiFlash® Memories– W25M512JW-IQ: 2 x 256M-bit (2 x 32MByte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 52MB/s continuous data transfer rate– More than 100,000 Program/Erase cycles– More than 20-year data retention	BGA	W25M512JWCIQ	3D model available Symbol and footprint available 3	1 Download Model
	C1210X225M5RACAUTO Yageo Group	1	SMD, MLCC, FT-CAP, Automotive Grade	Other	C1210X225M5RACAUTO	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVCAQ Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JVCAQ	3D model available Symbol and footprint available 3	1 Download Model
	C1210C225M5RAC7210 Yageo Group	1	SMD, MLCC, Temperature Stable, Class II	Other	C1210C225M5RAC7210	3D model available Symbol and footprint available 3	1 Download Model
	C1825C125M5UAC7210 Yageo Group	1	SMD Comm Z5U, Ceramic, 1.2 uF, 20%, 50 VDC, 125 VDC, 85°C, 10°C, Z5U, SMD, MLCC, General Purpose, Class III, 4 % , 83.3 MOhms, 170 mg, 1825, 4.5mm, 6.4mm, 1.1mm, 0.6mm, 4000, 78 Weeks, 20	Other	C1825C125M5UAC7210	3D model available Symbol and footprint available 3	1 Download Model
	TPS325M5165Q-QP7T 3Peak Incorporated	1	ARM® Cortex®M33 w/FPU TPS325M Microcontroller IC 32-Bit 156MHz 1024KB FLASH LQFP-100(14x14)	Quad Flat Packages	TPS325M5165Q-QP7T	3D model available Symbol and footprint available 3	1 Download Model

	W25M512JWBSM Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JWBSM	3D model available Symbol and footprint available 3	1 Download Model
	C1206C225M5RACTU Yageo Group	1	SMD, MLCC, Temperature Stable, Class II	Other	C1206C225M5RACTU	3D model available Symbol and footprint available 3	1 Download Model
	C1206X225M5RACAUTO Yageo Group	1	SMD, MLCC, FT-CAP, Automotive Grade	Other	C1206X225M5RACAUTO	3D model available Symbol and footprint available 3	1 Download Model
	C2225C225M5UACTM Yageo Group	1	SMD Comm Z5U, Ceramic, 2.2 uF, 20%, 50 VDC, 125 VDC, 85°C, 10°C, Z5U, SMD, MLCC, General Purpose, Class III, 4 % , 45.5 MOhms, 350 mg, 2225, 5.6mm, 6.4mm, 1.3mm, 0.6mm, 1000, 78 Weeks, 20	Other	C2225C225M5UACTM	3D model available Symbol and footprint available 3	1 Download Model
	C2225C125M5UACTU Yageo Group	1	SMD Comm Z5U, Ceramic, 1.2 uF, 20%, 50 VDC, 125 VDC, 85°C, 10°C, Z5U, SMD, MLCC, General Purpose, Class III, 4 % , 83.3 MOhms, 210 mg, 2225, 5.6mm, 6.4mm, 1mm, 0.6mm, 1000, 78 Weeks, 20	Other	C2225C125M5UACTU	3D model available Symbol and footprint available 3	1 Download Model
	TPS325M5156I-FSDR 3Peak Incorporated	1	Mixed-Signal Microcontrollers 156 MHz, based on ARM Core, TPSensor, rich analog, 512KB, Flash, 208KB RAM	Quad Flat No-Lead	TPS325M5156I-FSDR	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVESM Winbond	1	512Mb Serial NOR Flash 104MHz SON8 2.7V - 3.6V -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125 WSON8 8X6mm	Small Outline No-lead	W25M512JVESM	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWCSQ Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JWCSQ	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVFIQ Winbond	1	New Family of SpiFlash® Memories– W25M512JV: 2 x 256M-bit (2 x 32M-Byte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/s continuous data transfer rate– Min. 100K Program-Erase cycles persector– More than 20-year data retention	Small Outline Packages	W25M512JVFIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVBAQ Winbond	1	512Mb Serial NOR Flash 104MHz TFBGA (5X5)24	BGA	W25M512JVBAQ	3D model available Symbol and footprint available 3	1 Download Model
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