55.32 Model Download Search Results
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AD5532ABCZ-1REEL
Analog Devices
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1 | Digital to Analog Converters - DAC 32 CHANNEL, 14-BIT DAC & SHA I.C. −0.3 V to +17 V,−40°C to +85°C | BGA | AD5532ABCZ-1REEL |
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NE5532ADR
Texas Instruments
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1 | NE5532ADR, Dual Operational Amplifier 10MHz, 8-Pin SOIC | Small Outline Packages | NE5532ADR |
3
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09553296812741
HARTING
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1 | SMT Dsub 25 way straight Plug UNC 4-40 Harting D-sub Series 2.76mm Pitch 25 Way Straight SMT PCB D-sub Connector, Plug, with 4-40 UNC, Threaded Insert | Other | 09553296812741 |
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SLG55321-130010VTR
Renesas Electronics
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1 | Triple Rail High Voltage Gate Driver with internal charge pump for single/dual/triple N-Channel MOSFETs with VGS < 20 V. Soft switching 1.0 V to 20 V power rail. | Small Outline No-lead | SLG55321-130010VTR |
3
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SLLP7SMD05532S
Fischer Elektronik GmbH & Co. KG
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1 | Single Row, Male, Pitch 2.54mm, low profile in SMD-technology, 32 Position | Other | SLLP7SMD05532S |
3
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SE5532AD8G
onsemi
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1 | 8−Pin Plastic Small Outline (SO−8) Package | Small Outline Packages | SE5532AD8G |
3
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5532433-1
TE Connectivity
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1 | PCB Mount Header, Vertical, Board-to-Board, 75 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Signal, Black, Tube | Other | 5532433-1 |
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55323-5
TE Connectivity
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1 | Body Features: Terminal Profile Standard | Configuration Features: Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Base Material Copper Alloy | Contact Mating Area Plating Material Finish Bright | Contact Mating Area Plating Material Tin-Lead | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Fabrication Stamped & Formed | Contact Mating Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Finish Brig | Other | 55323-5 |
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760875532
Würth Elektronik
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1 | WE-UOST Universal Offline Standard Transformers Size EE16/8/5 SMT; Ui=275-375V; Uo1=12V/ 0.7A; Uo2=5V/1.36A; Uaux=14V; fswitch=60kHz | Other | 760875532 |
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NE5532AD8R2G
onsemi
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1 | Small-Signal Bandwidth: 10 MHz; Output Drive Capability: 600 Ω, 10 VRMS; Input Noise Voltage: 5.0 nV/(Hz)^0.5 (Typical); DC Voltage Gain: 50000; AC Voltage Gain: 2200 at 10 kHz; Power Bandwidth: 140 kHz; Slew Rate: 9.0 V/µs; Large Supply Voltage Range: ±3.0 to ±20 V; Compensated for Unity Gain | Small Outline Packages | NE5532AD8R2G |
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NE5532AD8G
onsemi
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1 | Last Shipments - Operational Amplifier, Low Noise, Dual | Other | NE5532AD8G |
3
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Q1553-20
iNRCORE
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1 | Pulse Transformers TRANSFORMER PBC QPL THT MIL-STD-1553 | Other | Q1553-20 |
3
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SA5532P
Texas Instruments
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1 | Dual Low-Noise Operational Amplifier | Dual-In-Line Packages | SA5532P |
3
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NE5532P
Texas Instruments
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1 | Dual Low-Noise High-Speed Audio Operational Amplifier | Dual-In-Line Packages | NE5532P |
3
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0553-2-15-15-21-14-10-0
Mill-Max
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1 | Pin Receptacle Connector 0.015" ~ 0.020" (0.38mm ~ 0.51mm) No Tail Press-Fit, Hex , -55°C ~ +125°C | Other | 0553-2-15-15-21-14-10-0 |
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NE5532AN
onsemi
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1 | Operational Amplifiers - Op Amps 3-20V Dual Low Noise | Dual-In-Line Packages | NE5532AN |
3
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NE5532APE4
Texas Instruments
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1 | Operational Amplifiers - Op Amps Dual Low-Noise Op Am p | Dual-In-Line Packages | NE5532APE4 |
3
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SGM5532YS8G/TR
Micro
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1 | Dual Low-Noise OperDual Low-Noise Operational Amplifierational Amplifier | Small Outline Packages | SGM5532YS8G/TR |
3
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SLG55321-130010V
Renesas Electronics
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1 | Triple Rail High Voltage Gate Driver with internal charge pump for single/dual/triple N-Channel MOSFETs with VGS < 20 V. Soft switching 1.0 V to 20 V power rail. | Small Outline No-lead | SLG55321-130010V |
3
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5532436-1
TE Connectivity
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1 | PCB Mount Header, Vertical, Board-to-Board, 100 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Gold (Au), Through Hole - Solder, Signal, Black | Other | 5532436-1 |
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5532600-4
TE Connectivity
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1 | CONN SEC II 31 POS 100 C/L R/A | Other | 5532600-4 |
3
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09553297812741
HARTING
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1 | D-Sub SMT 25pin straight male, 4-40UNC threading, PL3 (reel of 140 pieces) | Other | 09553297812741 |
3
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5055323-9
TE Connectivity
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1 | Body Features: Terminal Profile Standard | Configuration Features: Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 15 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Fabrication Stamped & Formed | Contact Mating Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Finish Matte | PCB Contact Termina | Other | 5055323-9 |
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AD5532BBCZ-1
Analog Devices
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1 | 32-Channel 14-bit Bipolar Voltage-Output DAC 74-Ball Chip Scale Package Ball Grid Array | BGA | AD5532BBCZ-1 |
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SLVW105532G
Fischer Elektronik GmbH & Co. KG
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1 | Single Row, Straight, Male; suitable for female header BLM, THT, 32 Position | Other | SLVW105532G |
3
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