586R0 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2-1586037-4 TE Connectivity	1	Configuration Features: Number of Rows 2 \| Number of Power Positions 24 \| PCB Mount Orientation Vertical \| Number of Positions 24 \| Contact Features: Contact Current Rating (Max) 9 AMP \| PCB Contact Termination Area Plating Material Tin \| Contact Layout Inline \| Contact Layout Matrix \| Contact Mating Area Plating Material Tin \| Contact Type Pin \| Contact Retention Within Housing Without \| Contact Mating Area Plating Material Thickness 2.03 MICM \| Contact Mating Area Plating Material Thickness 80 MICIN \| Dim	Header, Receptacle - Straight PTH Box	2-1586037-4	3D model available Symbol and footprint available 3	1 Download Model
	1586040-2 TE Connectivity	1	Configuration Features: Number of Positions 2 \| Number of Power Positions 2 \| PCB Mount Orientation Vertical \| Number of Rows 2 \| Contact Features: Contact Mating Area Plating Material Tin \| PCB Contact Termination Area Plating Material Tin \| Contact Current Rating (Max) 9 AMP \| Contact Retention Within Housing Without \| Contact Mating Area Plating Material Thickness 80 MICIN \| Contact Type Pin \| Contact Mating Area Plating Material Thickness 2.03 MICM \| Contact Layout Inline \| Dimensions: Compatible Insula	Other	1586040-2	3D model available Symbol and footprint available 3	1 Download Model
	SGM58602AXTRM20G/TR SGMICRO	1	Ultra-Low Noise, 24-Bit Analog-to-Digital Converters	Quad Flat No-Lead	SGM58602AXTRM20G/TR	3D model available Symbol and footprint available 3	1 Download Model
	1586042-2 TE Connectivity	1	Configuration Features: Number of Positions 2 \| Number of Power Positions 2 \| Number of Rows 2 \| PCB Mount Orientation Right Angle \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Contact Current Rating (Max) 9 AMP \| Contact Mating Area Plating Material Thickness 80 MICIN \| Contact Retention Within Housing Without \| Contact Mating Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 2.03 MICM \| Contact Layout Inline \| Contact Type Pin \| Dimensions: Compatible Ins	Header, Shrouded - Right Angle PTH Box	1586042-2	3D model available Symbol and footprint available 3	1 Download Model

	1-1337586-0 TE Connectivity	1	MCX R/A PCB Skt 50Ohm Gold Plt	Other	1-1337586-0	3D model available Symbol and footprint available 3	1 Download Model
	1586037-8 TE Connectivity	1	Configuration Features: Number of Power Positions 8 \| PCB Mount Orientation Vertical \| Number of Rows 2 \| Number of Positions 8 \| Contact Features: Contact Layout Matrix \| Contact Current Rating (Max) 9 AMP \| Contact Layout Inline \| Contact Mating Area Plating Material Thickness 80 â€“ 200 MICIN \| Contact Mating Area Plating Material Tin \| Contact Type Pin \| Contact Retention Within Housing Without \| PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 2.03 â€“	Header, Shrouded - Straight PTH Box	1586037-8	3D model available Symbol and footprint available 3	1 Download Model
	455860006 Molex	1	Mini-Fit Jr. Header, Dual Row, Right-Angle, Third Generation Polarization Type for PCIe Applications, 8 Circuits, UL 94V-0, 0.76µm Select Gold (Au) Plating, Black	Other	455860006	3D model available Symbol and footprint available 3	1 Download Model
	1586041-2 TE Connectivity	1	Configuration Features: Number of Rows 2 \| PCB Mount Orientation Right Angle \| Number of Positions 2 \| Number of Power Positions 2 \| Contact Features: Contact Mating Area Plating Material Thickness 80 â€“ 200 MICIN \| PCB Contact Termination Area Plating Material Tin \| Contact Type Pin \| Contact Mating Area Plating Material Thickness 2.03 â€“ 5.08 MICM \| Contact Layout Inline \| Contact Mating Area Plating Material Tin \| Contact Retention Within Housing Without \| Contact Current Rating (Max) 9 AMP \| Dimension	Other	1586041-2	3D model available Symbol and footprint available 3	1 Download Model
	1586041-4 TE Connectivity	1	Configuration Features: Number of Rows 2 \| PCB Mount Orientation Right Angle \| Number of Positions 4 \| Number of Power Positions 4 \| Contact Features: Contact Retention Within Housing Without \| Contact Layout Matrix \| Contact Mating Area Plating Material Thickness 80 â€“ 200 MICIN \| Contact Mating Area Plating Material Thickness 2.03 â€“ 5.08 MICM \| Contact Type Pin \| Contact Mating Area Plating Material Tin \| Contact Layout Inline \| Contact Layout Square Grid \| PCB Contact Termination Area Plating Material	Header, Shrouded - Right Angle PTH Box	1586041-4	3D model available Symbol and footprint available 3	1 Download Model
	908586002 Molex	1	5.00mm Pitch Appli-Mate RAST 5 Header, Vertical, 10 Circuits, Reference K30	Other	908586002	3D model available Symbol and footprint available 3	1 Download Model
	1-1586041-2 TE Connectivity	1	12w r/a pin header	Other	1-1586041-2	3D model available Symbol and footprint available 3	1 Download Model
	CL586-0825-0-54 Hirose	1	Hirose Electronic Tin plating 1um Min.Over Nickel 1um Min. 16 contacts FH12-16S-1SVA(54)	Other	CL586-0825-0-54	3D model not available Symbol and footprint available 2	1 Download Model
	SY58609UMG-TR Microchip	1	IC MUX 2:1 CML FSI INPUT 16-MLF	Quad Flat No-Lead	SY58609UMG-TR	3D model available Symbol and footprint available 3	1 Download Model
	1-1586042-0 TE Connectivity	1	TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 10 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A	Other	1-1586042-0	3D model available Symbol and footprint available 3	1 Download Model
	1-1586042-2 TE Connectivity	1	TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 12 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A	Header, Receptacle - Right Angle PTH Box	1-1586042-2	3D model available Symbol and footprint available 3	1 Download Model

	HWS15860 Bloggs Bits	1	2x40 Pin Female Header Machined .1"Sp	Header, Receptacle - Straight PTH Box	HWS15860	3D model available Symbol and footprint available 3	1 Download Model
	1586040-8 TE Connectivity	1	PCB Mount Header, Vertical, Wire-to-Board, 8 Position, 4.2 mm [.165 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Power, Natural	Other	1586040-8	3D model available Symbol and footprint available 3	1 Download Model
	1586038-6 TE Connectivity	1	Configuration Features: Number of Rows 2 \| PCB Mount Orientation Vertical \| Number of Positions 6 \| Number of Power Positions 6 \| Contact Features: Contact Layout Inline \| Contact Layout Matrix \| Contact Type Pin \| Contact Mating Area Plating Material Tin \| PCB Contact Termination Area Plating Material Tin \| Contact Retention Within Housing Without \| Contact Mating Area Plating Material Thickness 2.03 â€“ 5.08 MICM \| Contact Mating Area Plating Material Thickness 80 â€“ 200 MICIN \| Contact Current Rating (M	Other	1586038-6	3D model available Symbol and footprint available 3	1 Download Model
	MAX5860PUXH+ Analog Devices	1	Scalable High-Density Downstream Cable QAM Modulator 280=Pin FCBGA	BGA	MAX5860PUXH+	3D model available Symbol and footprint available 3	1 Download Model
	1-1586041-8 TE Connectivity	1	TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 18 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A	Other	1-1586041-8	3D model available Symbol and footprint available 3	1 Download Model
	455860005 Molex	1	Mini-Fit Jr. Header, Dual Row, Right-Angle, Third Generation Polarization Type for PCIe Applications, 8 Circuits, UL 94V-0, 0.76µm Select Gold (Au) Plating, Black	Other	455860005	3D model available Symbol and footprint available 3	1 Download Model
	NTP5860NG onsemi	1	Obsolete - Power MOSFET 60V 169A 3 mOhm Single N-Channel TO-220 Logic Level	Transistor Outline, Vertical	NTP5860NG	3D model available Symbol and footprint available 3	1 Download Model
	SL28SMDTHR05860Z Fischer Elektronik GmbH & Co. KG	1	male header 2.54 x 2.54 mm 60 contacts CuSn-alloy tin-plated ≤5 mΩ 3 A 250 V AC 2000 V UL 94 V-0 >107 Ω·m	Other	SL28SMDTHR05860Z	3D model available Symbol and footprint available 3	1 Download Model
	2-1586037-0 TE Connectivity	1	PCB Mount Header, Vertical, Wire-to-Board, 20 Position, 4.2 mm [.165 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, Power, Natural, Bag	Other	2-1586037-0	3D model available Symbol and footprint available 3	1 Download Model
	1-1586041-6 TE Connectivity	1	TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 16 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A	Header, Shrouded - Right Angle PTH Box	1-1586041-6	3D model available Symbol and footprint available 3	1 Download Model
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