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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PU5931FKMP70R003L
KEMET
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1 | 3 mOhms ±1% 7W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense, Moisture Resistant Metal Element | Resistor Chip | PU5931FKMP70R003L |
3
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55932-0310
Molex
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1 | Molex MICROCLASP Series, Series Number 55932, 2mm Pitch 3 Way 1 Row Straight PCB Header, Solder Termination, 3A | Other | 55932-0310 |
3
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0559320330
Molex
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1 | Conn Shrouded Header (4 Sides) HDR 3 POS 2mm Solder ST Thru-Hole MicroClasp Tray | Other | 0559320330 |
3
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1SMB5939BT3G
onsemi
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1 | ON Semiconductor 1SMB5939BT3G Zener Diode, 39V 5% 3 W SMT 2-Pin SMB | Diodes Moulded | 1SMB5939BT3G |
3
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1SMB5931BT3G
onsemi
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1 | ON Semiconductor 1SMB5931BT3G Zener Diode, 18V 5% 3 W SMT 2-Pin SMB | Diodes Moulded | 1SMB5931BT3G |
3
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1SMB5933BT3G
onsemi
|
1 | ON Semiconductor 1SMB5933BT3G Zener Diode, 22V 5% 3 W SMT 2-Pin SMB | Diodes Moulded | 1SMB5933BT3G |
3
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1SMB5938BT3G
onsemi
|
1 | ON Semiconductor 1SMB5938BT3G Zener Diode, 36V 5% 3 W SMT 2-Pin SMB | Diodes Moulded | 1SMB5938BT3G |
3
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NCP59301DS25R4G
onsemi
|
1 | Obsolete - LDO Regulator, 3 A, Low Dropout, High PSRR, Fast Transient Response | Other | NCP59301DS25R4G |
2
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NCV59301DS30R4G
onsemi
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1 | Last Shipments - LDO Regulator, 3 A, Low Dropout, High PSRR, Fast Transient Response | TO-XXX (Inc. DPAK) | NCV59301DS30R4G |
2
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215932-0370
Molex
|
1 | MOLEX - 215932-0370 - Pin Header, Signal, Wire-to-Board, 2.5 mm, 1 Rows, 3 Contacts, Surface Mount Right Angle | Other | 215932-0370 |
3
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1SMB5936BT3G
onsemi
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1 | ON Semiconductor 1SMB5936BT3G Zener Diode, 30V 5% 3 W SMT 2-Pin SMB | Diodes Moulded | 1SMB5936BT3G |
3
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NCP59301DS33R4G
onsemi
|
1 | Last Shipments - LDO Regulator, 3 A, Low Dropout, High PSRR, Fast Transient Response | Other | NCP59301DS33R4G |
2
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55935-0310
Molex
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1 | Molex MICROCLASP Series, Series Number 55935, 2mm Pitch 3 Way 1 Row Right Angle PCB Header, Solder Termination, 3A | Other | 55935-0310 |
3
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1SMB5937BT3G
onsemi
|
1 | ON Semiconductor 1SMB5937BT3G Zener Diode, 33V 5% 3 W SMT 2-Pin SMB | Diodes Moulded | 1SMB5937BT3G |
3
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2159310370
Molex
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1 | 2.50mm Pitch, Mini-Lock PCB Header, Single Row, Vertical, Surface Mount, Tin Plating, 3 Circuits, Tape and Reel | Other | 2159310370 |
3
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1930593
Phoenix Contact
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1 | PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 3 A, rated voltage (III/2): 250 V, contact surface: Tin, type of contact: Female connector, Number of potentials: 14, Number of rows: 1, Number of positions per row: 14, number of connections: 14, product range: FK-MPT 0,5/..-ICVA, pitch: 3.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.6 mm, Stecksystem: COMBICON COMPACT FK-MPT - IC, Locking: without, type of packaging: packed in cardboard, The touch-pr | Other | 1930593 |
3
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85931-6
TE Connectivity
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1 | Contact Features: Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Gold | Contact Mating Area Length 8.07 MM | Contact Current Rating (Max) 3 AMP | Mating Square Post Dimension .64 MM | Contact Type Pin | Contact Mating Area Length .318 INCH | Contact Underplating Material Nickel | Contact Shape & Form Square | Mating Square Post Dimension .025 INCH | PCB Contact Termination Area Plating Material Gold | Mechanical Attachment: Wire Insulation Support Without | Operation/Applicatio | Other | 85931-6 |
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2214593-2
TE Connectivity
|
1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Rear EONs per Port Column 3 | Number of Positions 152 | Number of Ports 4 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | Other | 2214593-2 |
3
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1776259-3
TE Connectivity
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1 | Body Features: Product Orientation Vertical | Primary Product Color Green | Configuration Features: Number of Positions 3 | Number of Rows 1 | Wire Entry Angle 180° | Wire Entry Location Top | Stacking Configuration Side Stackable | Stacked Levels Without | Contact Features: Contact Base Material Brass | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 10 AMP | Dimensions: Wire Size .3 – 2 MMSQ | Wire Size 22 – 14 AWG | Electrical Characteristics: Operating Voltage 300 VAC | Hous | Other | 1776259-3 |
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85931-2
TE Connectivity
|
1 | Contact Features: Mating Square Post Dimension .025 INCH | PCB Contact Termination Area Plating Material Gold | Mating Square Post Dimension .64 MM | Contact Mating Area Length .318 INCH | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Shape & Form Square | Contact Current Rating (Max) 3 AMP | Contact Underplating Material Nickel | Mechanical Attachment: Wire Insulation Support Without | Operation/Application: Circuit Application Signal | Packa | Other | 85931-2 |
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2214593-2
TE Connectivity
|
1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Rear EONs per Port Column 3 | Number of Positions 152 | Number of Ports 4 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | Other | 2214593-2 |
3
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1776259-3
TE Connectivity
|
1 | Body Features: Product Orientation Vertical | Primary Product Color Green | Configuration Features: Number of Positions 3 | Number of Rows 1 | Wire Entry Angle 180° | Wire Entry Location Top | Stacking Configuration Side Stackable | Stacked Levels Without | Contact Features: Contact Base Material Brass | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 10 AMP | Dimensions: Wire Size .3 – 2 MMSQ | Wire Size 22 – 14 AWG | Electrical Characteristics: Operating Voltage 300 VAC | Hous | Other | 1776259-3 |
3
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SZ1SMB5935BT3G
onsemi
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1 | ON SEMICONDUCTOR - SZ1SMB5935BT3G - ZENER DIODE, AEC-Q101, 27V, DO-214AA | Diodes Moulded | SZ1SMB5935BT3G |
3
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55932-0830
Molex
|
1 | Headers & Wire Housings 2.0 WtB Plg Hsg Assy sy Str W/O Boss 8Ckt | Other | 55932-0830 |
3
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55959-3430
Molex
|
1 | Headers & Wire Housings 34 Ckt R.A. Header | Other | 55959-3430 |
3
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