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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	HSL0820-3R8256-R Eaton	1	CAP HSL 3.8V 25F 0.65ohm LT	Capacitor, Polarized Radial Diameter	HSL0820-3R8256-R	3D model available Symbol and footprint available 3	1 Download Model
	R1EV58256BTDRBI#B0 Renesas Electronics	1	Support is limited to customers who have already adopted these products.Renesas Electronics’ R1EV58256BxxN series and R1EV58256BxxR series are electrically erasable and programmable EEPROM’s organized as 32768-word  8-bit. They have realized high speed, low power consumption and high reliability by employing advanced MONOS memory technology and CMOS process and circuitry technology. They also have a 64-byte page programming function to make their write operations faster.	Small Outline Packages	R1EV58256BTDRBI#B0	3D model available Symbol and footprint available 3	1 Download Model
	2358256-1 TE Connectivity	1	Configuration Features: Number of Positions 50 \| Number of Power Positions 50 \| Number of Signal Positions 0 \| Number of Dual Positions 25 \| Contact Features: Contact Current Rating (Max) 9.3 AMP \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 30 MICIN \| Dimensions: Power Contact Centerline .1 INCH \| Power Contact Centerline 2.54 MM \| Electrical Characteristics: Operating Voltage 100 V \| Operating Voltage	Other	2358256-1	3D model available Symbol and footprint available 3	1 Download Model
	SL16SMD18256GECO Fischer Elektronik GmbH & Co. KG	1	male header	Other	SL16SMD18256GECO	3D model available Symbol and footprint available 3	1 Download Model

	SL16SMD18256ZP Fischer Elektronik GmbH & Co. KG This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Male SMD Header, 56Position, 250 V AC, 2000V, UL 94 V-0	Other	SL16SMD18256ZP	3D model available Symbol and footprint available 3	1 Download Model
	B32776G8256K000 TDK	1	Metallized Polypropylene Capacitors (MKP/MFP), 25uF, 800V DC, 28mm(W) x 42.5mm(H) x 41.5mm(L)	Other	B32776G8256K000	3D model available Symbol and footprint available 3	1 Download Model
	1825650000 Weidmüller	1	PCB terminal, 160 V, 17.5 A, Pitch in mm: 3.50, 1.5 mm², Number of poles: 3, PUSH IN with actuator, THT/THR solder connection, 180°, Tube	Other	1825650000	3D model available Symbol and footprint available 3	1 Download Model
	1825670000 Weidmüller	1	PCB terminal, 160 V, 17.5 A, Pitch in mm: 3.50, 1.5 mm², Number of poles: 5, PUSH IN with actuator, THT/THR solder connection, 180°, Tube	Other	1825670000	3D model available Symbol and footprint available 3	1 Download Model
	1825680000 Weidmüller	1	PCB terminal, 160 V, 17.5 A, Pitch in mm: 3.50, 1.5 mm², Number of poles: 6, PUSH IN with actuator, THT/THR solder connection, 180°, Tube	Other	1825680000	3D model available Symbol and footprint available 3	1 Download Model
	MGA-82563-BLKG Avago Technologies	1	3 V, 17 dBm Amplifier	Other	MGA-82563-BLKG	3D model not available Symbol and footprint available 2	1 Download Model
	IS43TR82560C-125KBL Integrated Silicon Solution Inc.	1	Standard Voltage: VDD and VDDQ = 1.5V ± 0.075VLow Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V - Backward compatible to 1.5VHigh speed data transfer rates with systemfrequency up to 933 MHz8 internal banks for concurrent operation8n-Bit pre-fetch architectureProgrammable CAS LatencyProgrammable Additive Latency: 0, CL-1,CL-2Programmable CAS WRITE latency (CWL) basedon tCKProgrammable Burst Length: 4 and 8Programmable Burst Sequence: Sequential orInterleaveBL switch on the fl	BGA	IS43TR82560C-125KBL	3D model available Symbol and footprint available 3	1 Download Model
	B82562N4683M000 TDK	1	Fixed Inductors 68uH 1.1A AEC-Q200	Other	B82562N4683M000	3D model available Symbol and footprint available 3	1 Download Model
	IS43TR82560D-125KBLI Integrated Silicon Solution Inc.	1	DRAM 2G, 1.5V, DDR3L, 256Mx8, 1600MT/s @ 11-11-11, 78 ball BGA (8mm x10.5mm) RoHS, IT	BGA	IS43TR82560D-125KBLI	3D model available Symbol and footprint available 3	1 Download Model
	MGA-82563-TR1G Avago Technologies	1	3 V, 17 dBm Amplifier	Other	MGA-82563-TR1G	3D model not available Symbol and footprint available 2	1 Download Model
	715P68256JD3 Vishay	1	Capacitor, Polypropylene, 6.8nf, 600V, 5±%	Other	715P68256JD3	3D model available Symbol and footprint available 3	1 Download Model

	IRLR8256PBF Infineon	1	MOSFET N-CH 25V 81A DPAK	Other	IRLR8256PBF	3D model available Symbol and footprint available 3	1 Download Model
	B82562N4332N000 TDK	1	Power Inductors - SMD 3.3uH 3.7A AEC-Q200	Other	B82562N4332N000	3D model available Symbol and footprint available 3	1 Download Model
	HSH0814-3R8256-R Eaton	1	3.8 V operating voltage for high power andhigh energy Up to 10 times energy density compared tostandard supercapacitors Low ESR for high power density UL recognized Low self discharge ideal for use with batteries	Capacitor, Polarized Radial Diameter	HSH0814-3R8256-R	3D model available Symbol and footprint available 3	1 Download Model
	1782569 Phoenix Contact	1	MC 1,5/12-G-3,81 P26 THRR72 - PCB headers, nominal cross section: 1.5 mm², color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 12, number of rows: 1, number of positions: 12, number of connections: 12, product range: MC 1,5/..-G-THR, pitch: 3.81 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,	Other	1782569	3D model available Symbol and footprint available 3	1 Download Model
	B32776E8256J000 TDK	1	Metallized Polypropylene Capacitors (MKP/MFP), 25uF, 800V DC, 28mm(W) x 42.5mm(H) x 41.5mm(L)	Other	B32776E8256J000	3D model available Symbol and footprint available 3	1 Download Model
	R1EV58256BSCNBI#B0 Renesas Electronics	1	Support is limited to customers who have already adopted these products.Renesas Electronics’ R1EV58256BxxN series and R1EV58256BxxR series are electrically erasable and programmable EEPROM’s organized as 32768-word  8-bit. They have realized high speed, low power consumption and high reliability by employing advanced MONOS memory technology and CMOS process and circuitry technology. They also have a 64-byte page programming function to make their write operations faster.	Small Outline Packages	R1EV58256BSCNBI#B0	3D model available Symbol and footprint available 3	1 Download Model
	B32776Z8256K000 TDK	1	Metallized Polypropylene Capacitors (MKP/MFP), 25uF, 800V DC, 28mm(W) x 42.5mm(H) x 42mm(L)	Other	B32776Z8256K000	3D model available Symbol and footprint available 3	1 Download Model
	1825678 Phoenix Contact	1	MCV 1,5/ 3-G-3,81 P20 THRR32 - PCB headers, nominal cross section: 1.5 mm², color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: MCV 1,5/..-G-THR, pitch: 3.81 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5,	Other	1825678	3D model available Symbol and footprint available 3	1 Download Model
	1825660000 Weidmüller	1	PCB terminal, 160 V, 17.5 A, Pitch in mm: 3.50, 1.5 mm², Number of poles: 4, PUSH IN with actuator, THT/THR solder connection, 180°, Tube	Other	1825660000	3D model available Symbol and footprint available 3	1 Download Model
	IS43TR82560DL-107MBLI Integrated Silicon Solution Inc.	1	DRAM 2G, 1.35V, DDR3L, 256Mx8, 1866MT/s @ 13-13-13, 78 ball BGA (8mm x10.5mm) RoHS, IT	BGA	IS43TR82560DL-107MBLI	3D model available Symbol and footprint available 3	1 Download Model
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