86-03 Model Download Search Results
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LMP8603QMMX/NOPB
Texas Instruments
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1 | Current Sense Amplifiers Automotive Grade, 60-V, Bi-Directional, Low- or High-Side, Voltage Output Current Sensing Amplifier 8-VSSOP -40 to 125 | Small Outline Packages | LMP8603QMMX/NOPB |
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LMP8603QMM/NOPB
Texas Instruments
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1 | Current Sense Amplifiers Automotive Grade, 60-V, Bi-Directional, Low- or High-Side, Voltage Output Current Sensing Amplifier 8-VSSOP -40 to 125 | Small Outline Packages | LMP8603QMM/NOPB |
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M20-7860346
Harwin
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1 | M20: 3 Pos Receptacle SIL Straight SMT Connector 7.5mm high Tin | Other | M20-7860346 |
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LT8603JUJ#TRPBF
Analog Devices
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1 | 42V, Low IQ, Quad Output Triple Monolithic Buck Converter and Boost Controller | Quad Flat No-Lead | LT8603JUJ#TRPBF |
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1586037-8
TE Connectivity
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1 | Configuration Features: Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 8 | Contact Features: Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 – | Header, Shrouded - Straight PTH Box | 1586037-8 |
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SK448603xM3L
Fischer Elektronik GmbH & Co. KG
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1 | Extruded heatsink for PCB mounting | Other | SK448603xM3L |
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502386-0370
Molex
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1 | Headers & Wire Housings 3P CLIKMATE RECPT RIGHT ANGLE TIN | Other | 502386-0370 |
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LT8603EUJ#WPBF
Analog Devices
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1 | 42V, Low IQ, Quad Output Triple Monolithic Buck Converter and Boost Controller | Quad Flat No-Lead | LT8603EUJ#WPBF |
3
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861020786030
Würth Elektronik
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1 | WCAP-AIG5 Aluminum Electrolytic Capacitors ANDQ450103M063DSIC2B000; Snap-in; 10000 µF ± 20%; 63 V (DC); 2000 h; - 40 °C / +105 °C; size DxL 35.0 x 45.0; pitch 10.0; Max. Iripple 5510 mA@ 120 Hz; LC 12600 µA; DF 30%; | Capacitor, Polarized Radial Diameter | 861020786030 |
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LT8603JUJ#WTRPBF
Analog Devices
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1 | 42V, Low IQ, Quad Output Triple Monolithic Buck Converter and Boost Controller | Quad Flat No-Lead | LT8603JUJ#WTRPBF |
3
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5023860370
Molex
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1 | 1.25mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Right-Angle, Tin (Sn) Plating, 3 Circuits | Other | 5023860370 |
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1786035
Phoenix Contact
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1 | ICV 2,5/11-G-5,08 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Socket, number of potentials: 11, number of rows: 1, number of positions: 11, number of connections: 11, product range: ICV 2,5/..-G, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.6 mm, number of solder pins per potential: 2, plug-in system: COMBICON MSTB 2,5, Pin connector patter | Other | 1786035 |
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1-1586039-2
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 12 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A | Other | 1-1586039-2 |
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1586037-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 – | Header, Shrouded - Straight PTH Box | 1586037-6 |
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1586037-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 4 | Number of Power Positions 4 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Tin | Contact Layout Matrix | Contact Type Pin | Contact Layout Square Grid | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Co | Header, Shrouded - Straight PTH Box | 1586037-4 |
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FTE-186-03-G-DV-A
SAMTEC
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1 | 172 Position, 0.80 mm Surface Mount Micro Terminal Strip, Vertical Mount | Other | FTE-186-03-G-DV-A |
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FTE-186-03-G-DV-ES-A
SAMTEC
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1 | 172 Position, 0.80 mm Surface Mount Micro Terminal Strip, Vertical Mount | Other | FTE-186-03-G-DV-ES-A |
2
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LT8603JUJ#WPBF
Analog Devices
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1 | Quad Output Triple Buck Converter and Boost Controller | Quad Flat No-Lead | LT8603JUJ#WPBF |
3
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AD8603AUJZ-R2
Analog Devices
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1 | AD8603AUJZ-R2, Operational Amplifier 0.4MHz CMOS, Rail-Rail, 3 V, 5-Pin TSOT | SOT23 (5-Pin) | AD8603AUJZ-R2 |
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LMP8603MMX/NOPB
Texas Instruments
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1 | Current Sense Amplifiers 60-V, Bi-Directional, Low- or High-Side, Voltage Output Current Sensing Amplifier 8-VSSOP -40 to 125 | Small Outline Packages | LMP8603MMX/NOPB |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LMP8603MME/NOPB
Texas Instruments
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1 | 60-V, Bi-Directional, Low- or High-Side, Voltage Output Current Sensing Amplifier | Small Outline Packages | LMP8603MME/NOPB |
3
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502386-0371
Molex
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1 | Headers & Wire Housings 1.25CLIKMATE PCB REC SR RA GLD PLTG 3CKT | Other | 502386-0371 |
3
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LT8603EUJ#WTRPBF
Analog Devices
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1 | 42V, Low IQ, Quad Output Triple Monolithic Buck Converter and Boost Controller | Quad Flat No-Lead | LT8603EUJ#WTRPBF |
3
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1318603
Phoenix Contact
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1 | LPT 6/ 3-7,5-ZF - Printed circuit board terminal, nominal current: 41 A, rated voltage (III/2): 1000 V, nominal cross section: 6 mm2, number of potentials: 3, number of rows: 1, number of positions per row: 3, product range: LPT 6/, pitch: 7.5 mm, connection method: Lever Push-in connection, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Zigzag pinning M, Solder pin [P]: 3.6 mm, type of packaging: packed in cardboard | Other | 1318603 |
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1586038-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Matrix | Contact Layo | Header, Shrouded - Straight PTH Box | 1586038-8 |
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![Part Image](["https://www.mouser.com/images/texasinstruments/images/ITP_TI_VSSOP-8_DGK_t.jpg",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/2477_LMP8603-Q1.jpg"])
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