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Part Image Part Image 1 Molex 75586 Series 0.8mm 38 Way 2 Row Right Angle PCB Socket Surface Mount Wire to Board Other 75586-0010 1 Download Model
Part Image Part Image 1 20 Position Female Connector Non Specified - Single Edge Gold 0.156" (3.96mm) Green Other 337-020-558-608 1 Download Model
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1 0.80mm Pitch, iPass I/O Surface Mount Receptacle, Right-Angle, External Application, 36 Circuit, 0.76µm Gold (Au) Other 75586-0008 1 Download Model
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HI-35860PQT Holt Integrated Circuits Inc.
1 44 Pin Plastic Quad Flat Pack (MQFP) Holt Integrated Circuits Quad Flat Packages HI-35860PQT 1 Download Model
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1586038-8 TE Connectivity
1 Configuration Features: Number of Rows 2 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Matrix | Contact Layo Header, Shrouded - Straight PTH Box 1586038-8 1 Download Model
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SL17SMD05860GECO Fischer Elektronik GmbH & Co. KG
1 male header Other SL17SMD05860GECO 1 Download Model
Part Image Part Image 1 Low Power Programmable Oscillator, 3.2 x 2.5 x 0.75 mm Package Other SIT8008BI-22-33E-58.600000 1 Download Model
Part Image Part Image 1 Low Power Programmable Oscillator, 3.2 x 2.5 x 0.75 mm Package Other SIT8008AI-22-33E-58.600000 1 Download Model
Part Image Part Image 1 Ultra-Low Quiescent Current, Synchronous Step-Down PFM DC/DC Converter with Output voltage selectable function, WLP-6-03 Other XC9276B5860R-G 1 Download Model
Part Image Part Image 1 Ultra-Low Quiescent Current, Synchronous Step-Down PFM DC/DC Converter with Output voltage selectable function, WLP-6-03 Other XC9276D5860R-G 1 Download Model
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1586041-8 TE Connectivity
1 Configuration Features: Number of Positions 8 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Layout Matrix | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Type Pin | Contact Retention Within Housing Without | Contact L Other 1586041-8 1 Download Model
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MAX5860FUXH+ Analog Devices
1 RF IC Modulator General Purpose 47MHz ~ 1.006GHz Up Converter 280-FCBGA (20x14) BGA MAX5860FUXH+ 1 Download Model
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HI5860IBZ Renesas Electronics
1 The HI5860 is a 12-bit, 130MSPS (Mega Samples Per Second), High-Speed, low power, D/A converter which is implemented in an advanced CMOS process. Operating from a single +3V to +5V supply, the converter provides 20mA of full scale output current and includes edge-triggered CMOS input data latches. Low glitch energy and excellent frequency domain performance are achieved using a segmented current source architecture. This device complements the HI5x60 and HI5x28 family of High-Speed converters, which include Small Outline Packages HI5860IBZ 1 Download Model
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1586037-4 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Positions 4 | Number of Power Positions 4 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Tin | Contact Layout Matrix | Contact Type Pin | Contact Layout Square Grid | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Co Header, Shrouded - Straight PTH Box 1586037-4 1 Download Model
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1586037-6 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 – Header, Shrouded - Straight PTH Box 1586037-6 1 Download Model
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1-1586039-2 TE Connectivity
1 TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 12 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A Other 1-1586039-2 1 Download Model
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1715860 Phoenix Contact
1 MKDS 1,5/ 4-5,08 BD:1-4 - Printed circuit board terminal, nominal current: 17.5 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm2, number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: MKDS 1,5, pitch: 5.08 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins Other 1715860 1 Download Model
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1-1586041-0 TE Connectivity
1 TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 10 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A Header, Receptacle - Right Angle PTH Box 1-1586041-0 1 Download Model
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2-1586041-0 TE Connectivity
1 Configuration Features: Number of Positions 20 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 20 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Matrix | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Layout Inline | Other 2-1586041-0 1 Download Model
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1586041-6 TE Connectivity
1 Configuration Features: Number of Power Positions 6 | Number of Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.03 â Other 1586041-6 1 Download Model
Part Image Part Image 1 Ultra-Low Noise, 24-Bit Analog-to-Digital Converters Small Outline Packages SGM58601AXSS28G/TR 1 Download Model
Part Image Part Image 1 MOLEX - 75586-0002 - I/O CONNECTOR, MINI SAS, PLUG, 68POS Other 75586-0002 1 Download Model
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BT258-600R,127 WeEn Semiconductors
1 SCRs RAIL SCR Transistor Outline, Vertical BT258-600R,127 1 Download Model
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LP5860TMRKPR Texas Instruments
1 LED Driver IC 18 Output Linear Constant Current Analog, I2C, PWM, SPI Dimming 100mA 40-VQFN (5x5) Quad Flat No-Lead LP5860TMRKPR 1 Download Model
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1586039-2 TE Connectivity
1 TE Connectivity VAL-U-LOK, 4.2mm Pitch, 2 Way, 2 Row, Straight PCB Header Other 1586039-2 1 Download Model
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