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75586-0010
Molex
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1 | Molex 75586 Series 0.8mm 38 Way 2 Row Right Angle PCB Socket Surface Mount Wire to Board | Other | 75586-0010 |
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337-020-558-608
EDAC
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1 | 20 Position Female Connector Non Specified - Single Edge Gold 0.156" (3.96mm) Green | Other | 337-020-558-608 |
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75586-0008
Molex
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1 | 0.80mm Pitch, iPass I/O Surface Mount Receptacle, Right-Angle, External Application, 36 Circuit, 0.76µm Gold (Au) | Other | 75586-0008 |
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HI-35860PQT
Holt Integrated Circuits Inc.
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1 | 44 Pin Plastic Quad Flat Pack (MQFP) Holt Integrated Circuits | Quad Flat Packages | HI-35860PQT |
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1586038-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Matrix | Contact Layo | Header, Shrouded - Straight PTH Box | 1586038-8 |
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SL17SMD05860GECO
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | SL17SMD05860GECO |
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SIT8008BI-22-33E-58.600000
SiTime
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1 | Low Power Programmable Oscillator, 3.2 x 2.5 x 0.75 mm Package | Other | SIT8008BI-22-33E-58.600000 |
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SIT8008AI-22-33E-58.600000
SiTime
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1 | Low Power Programmable Oscillator, 3.2 x 2.5 x 0.75 mm Package | Other | SIT8008AI-22-33E-58.600000 |
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XC9276B5860R-G
Torex
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1 | Ultra-Low Quiescent Current, Synchronous Step-Down PFM DC/DC Converter with Output voltage selectable function, WLP-6-03 | Other | XC9276B5860R-G |
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XC9276D5860R-G
Torex
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1 | Ultra-Low Quiescent Current, Synchronous Step-Down PFM DC/DC Converter with Output voltage selectable function, WLP-6-03 | Other | XC9276D5860R-G |
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1586041-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Layout Matrix | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Type Pin | Contact Retention Within Housing Without | Contact L | Other | 1586041-8 |
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MAX5860FUXH+
Analog Devices
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1 | RF IC Modulator General Purpose 47MHz ~ 1.006GHz Up Converter 280-FCBGA (20x14) | BGA | MAX5860FUXH+ |
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HI5860IBZ
Renesas Electronics
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1 | The HI5860 is a 12-bit, 130MSPS (Mega Samples Per Second), High-Speed, low power, D/A converter which is implemented in an advanced CMOS process. Operating from a single +3V to +5V supply, the converter provides 20mA of full scale output current and includes edge-triggered CMOS input data latches. Low glitch energy and excellent frequency domain performance are achieved using a segmented current source architecture. This device complements the HI5x60 and HI5x28 family of High-Speed converters, which include | Small Outline Packages | HI5860IBZ |
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1586037-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 4 | Number of Power Positions 4 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Tin | Contact Layout Matrix | Contact Type Pin | Contact Layout Square Grid | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Co | Header, Shrouded - Straight PTH Box | 1586037-4 |
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1586037-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 – | Header, Shrouded - Straight PTH Box | 1586037-6 |
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1-1586039-2
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 12 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A | Other | 1-1586039-2 |
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1715860
Phoenix Contact
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1 | MKDS 1,5/ 4-5,08 BD:1-4 - Printed circuit board terminal, nominal current: 17.5 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm2, number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: MKDS 1,5, pitch: 5.08 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins | Other | 1715860 |
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1-1586041-0
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 10 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Header, Receptacle - Right Angle PTH Box | 1-1586041-0 |
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2-1586041-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 20 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Matrix | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Layout Inline | | Other | 2-1586041-0 |
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1586041-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.03 â | Other | 1586041-6 |
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SGM58601AXSS28G/TR
SGMICRO
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1 | Ultra-Low Noise, 24-Bit Analog-to-Digital Converters | Small Outline Packages | SGM58601AXSS28G/TR |
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75586-0002
Molex
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1 | MOLEX - 75586-0002 - I/O CONNECTOR, MINI SAS, PLUG, 68POS | Other | 75586-0002 |
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BT258-600R,127
WeEn Semiconductors
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1 | SCRs RAIL SCR | Transistor Outline, Vertical | BT258-600R,127 |
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LP5860TMRKPR
Texas Instruments
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1 | LED Driver IC 18 Output Linear Constant Current Analog, I2C, PWM, SPI Dimming 100mA 40-VQFN (5x5) | Quad Flat No-Lead | LP5860TMRKPR |
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1586039-2
TE Connectivity
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1 | TE Connectivity VAL-U-LOK, 4.2mm Pitch, 2 Way, 2 Row, Straight PCB Header | Other | 1586039-2 |
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