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MKP1847C570255K2
Vishay
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1 | AC Filtering Metalized Polypropylene Film Capacitor Radial Type | Other | MKP1847C570255K2 |
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1702506
Phoenix Contact
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1 | PCB terminal block - FFKDSA1/V1-5,08- 4 BD:1-4Q | Other | 1702506 |
3
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885012007025
Würth Elektronik
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1 | WCAP-CSGP General Purpose MLCC NP00805472J016DFCT10000; SMT Chip; 4.7 nF ± 5%; 16 V(DC); -55°C / +125°C; size 0805; LxWxH 2.0 x 1.25 x 1.25; Term. Cu/Ni/Sn | Capacitor Chip Non-polarised | 885012007025 |
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0930702508
Molex
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1 | Appli-Mate RAST 2.5 Header, Vertical, 8 Circuits, Tin (Sn) Plating, Glow-Wire Capable, Positioning Keys B, C, D, G, H and I Blocked, with Latch, Natural | Other | 0930702508 |
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R7F70254EAFABG -C
Renesas Electronics
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1 | The RH850/U2B next-generation 28nm cross-domain automotive control microcontroller series realizes up to 6 cores x 400MHz incl. Virtualization Support and Quality-of-Service (QoS). The RH850/U2B is equipped with the latest HW-support technologies to realize the integration of multiple ASIL-D SW-partitions into one ECU while ensuring Freedom-From-Interference between the concurrently running applications to meet the ISO26262 ASIL-D standard.To enhance the performance level for real-time control the RH850/U2B | BGA | R7F70254EAFABG -C |
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930702502
Molex
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1 | Appli-Mate RAST 2.5 Header, Vertical, 8 Circuits, Tin (Sn) Plating, Glow-Wire Capable | Other | 930702502 |
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R7F70254EAFABB -C
Renesas Electronics
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1 | The RH850/U2B next-generation 28nm cross-domain automotive control microcontroller series realizes up to 6 cores x 400MHz incl. Virtualization Support and Quality-of-Service (QoS). The RH850/U2B is equipped with the latest HW-support technologies to realize the integration of multiple ASIL-D SW-partitions into one ECU while ensuring Freedom-From-Interference between the concurrently running applications to meet the ISO26262 ASIL-D standard.To enhance the performance level for real-time control the RH850/U2B | BGA | R7F70254EAFABB -C |
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EZP-V70256MTB
Panasonic
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1 | Series/Type: EZPV, DC, Rated voltage (V): 700, Category Temp. Range (°C): -40 to 105 (85), Capacitance (µF): 25, Capacitance tolerance (%): +/-10, L Dimension (mm): 41, T (mm): 30, H (mm): 50.5, Lead spacing (mm): 37.5, (P2): 10.2 | Other | EZP-V70256MTB |
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C1206C103K2RAC7025
Yageo Group
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1 | Cap Ceramic 0.01uF 200V X7R 10% Pad SMD 1206 125°C T/R | Capacitor Chip Non-polarised | C1206C103K2RAC7025 |
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C0805C102J5RAC7025
Yageo Group
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 1000pF X7R 0805 5% | Capacitor Chip Non-polarised | C0805C102J5RAC7025 |
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MPXV7025GC6U
NXP
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1 | Pressure Sensor ±3.63PSI (±25kPa) Compound Male - 0.13" (3.18mm) Tube 0.2 V ~ 4.7 V 8-SMD, Gull Wing, Top Port, -40°C ~ 125°C | Other | MPXV7025GC6U |
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10132797-025100LF
Amphenol
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1 | Board to Board & Mezzanine Connectors 4.3mm Height,Dbl Rw 20P, Plug, Connector | Other | 10132797-025100LF |
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067702.5MXEP
LITTELFUSE
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1 | 2.5 A 250 V AC DC Fuse Cartridge, Ceramic Through Hole Cartridge, Non-Standard (Axial) | Other | 067702.5MXEP |
2
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C0805C223K1RAC7025
Yageo Group
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Capacitor Chip Non-polarised | C0805C223K1RAC7025 |
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ADF7025BCPZ
Analog Devices
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1 | Analog Devices ADF7025BCPZ, RF Transceiver 431MHz to 464MHz Triple Band 48-Pin LFCSP | Quad Flat No-Lead | ADF7025BCPZ |
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C0805C102J1GAC7025
Yageo Group
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT 100volts 1000pF C0G 5% | Capacitor Chip Non-polarised | C0805C102J1GAC7025 |
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C0805C330J5GAC7025
Yageo Group
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 33pF C0G 0805 5% | Capacitor Chip Non-polarised | C0805C330J5GAC7025 |
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TPS77025DBVR
Texas Instruments
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1 | Texas Instruments TPS77025DBVR, LDO Voltage Regulator, 0.05A, 2.5 V 3%, 2.7 → 10 Vin, 5-Pin SOT-23 | SOT23 (5-Pin) | TPS77025DBVR |
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MPXV7025DP
NXP
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1 | Board Mount Pressure Sensors SOP DUAL PORT | Other | MPXV7025DP |
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EZPV70256MDS
Panasonic
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1 | Series/Type: EZPV-D, DC, Rated voltage (V): 700, Category Temp. Range (°C): -40 to 105 (85), Capacitance (µF): 25, Capacitance tolerance (%): +/-10, Dielectric material: MPP, L Dimension (mm): 57.5, T Dimension (mm): 25, H Dimension (mm): 40, Lead spacing (mm): 52.5, Short cut lead wire type, AEC-Q200: base on, Safety Mechanism: installed | Other | EZPV70256MDS |
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R7F70254FAFABA-C
Renesas Electronics
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1 | The RH850/U2B is Renesas' cross-domain microcontroller series, a new generation of high-end automotive-control devices, designed to address the growing need to integrate multiple applications into a single chip to realize unified electronic control units (ECUs) for the evolving electrical/electronic architecture (E/E architecture). Based on 28 nanometer (nm) process technology, the 32-bit RH850/U2B automotive MCU builds on key functions from Renesas’ RH850/Ex Series for engine control and RH850/Cx Series fo | BGA | R7F70254FAFABA-C |
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1731070253
Molex
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1 | FCT Mixed Layout D-Sub Connector, Female, Straight, PCB Through Hole, Gold Plating, Tin-plated Shell, 6.60mm Snap-in Bolt, 7 Circuits Loaded (2 High Power, 5 Signal), Green Insulator | Other | 1731070253 |
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040702.5WRA
LITTELFUSE
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1 | Surface Mount Fuse Ceramic Fuse > 407A Series | Fuses Chip | 040702.5WRA |
3
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930702503
Molex
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1 | Appli-Mate RAST 2.5 Header, Vertical, 8 Circuits, Tin (Sn) Plating, Glow-Wire Capable | Other | 930702503 |
3
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R7F70254FAFABB -C
Renesas Electronics
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1 | The RH850/U2B next-generation 28nm cross-domain automotive control microcontroller series realizes up to 6 cores x 400MHz incl. Virtualization Support and Quality-of-Service (QoS). The RH850/U2B is equipped with the latest HW-support technologies to realize the integration of multiple ASIL-D SW-partitions into one ECU while ensuring Freedom-From-Interference between the concurrently running applications to meet the ISO26262 ASIL-D standard.To enhance the performance level for real-time control the RH850/U2B | BGA | R7F70254FAFABB -C |
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