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Technical Content

GW JC Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
GW QTLQS1.LM-LWL2-XX55-1-65-R18 ams OSRAM
1 AMS OSRAM GROUP - GW QTLQS1.LM-LWL2-XX55-1-65-R18 - High Brightness LED, OSCONIQ E 2835, White, 120 °, 144 lm, 4000 K, 200 mA Other GW QTLQS1.LM-LWL2-XX55-1-65-R18
3D model not available
Symbol and footprint available
 2
1 Download Model
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10142708-100001LF Amphenol Communications Solutions
1 Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 10 Positions, 30μin Gold (100μin Tin on Tails) plating, GW Compatible LCP, Without Pegs, Tray. Other 10142708-100001LF
3D model available
Symbol and footprint available
 3
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10132449-1611GLF Amphenol Communications Solutions
1 Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 16 Positions, GW Compatible PA9T, Tray packing. Other 10132449-1611GLF
3D model available
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 3
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10131319-10422G0LF Amphenol Communications Solutions
1 Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 30μin Gold on Contact area (100μin Matte Tin on Tails) plating, Black Color, 10 Positions, LCP, GW Compatible, Tray Packing. Other 10131319-10422G0LF
3D model available
Symbol and footprint available
 3
1 Download Model
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1969795-1 TE Connectivity
1 Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Housing Without | Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Housing Features: Housing C Header, Shrouded - Straight PTH Box 1969795-1
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1586892-3 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Pre-Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max Other 1586892-3
3D model available
Symbol and footprint available
 3
1 Download Model
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1744446-8 TE Connectivity
1 Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 2 – 5 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.032 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | Mating Pin Diameter .6 MM | Mating Pin Diameter .024 INCH | Contact Mating Other 1744446-8
3D model available
Symbol and footprint available
 3
1 Download Model
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1969815-1 TE Connectivity
1 Configuration Features: Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: Ope Other 1969815-1
3D model available
Symbol and footprint available
 3
1 Download Model
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1744428-8 TE Connectivity
1 Configuration Features: Number of Power Positions 8 | Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 8 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Mating Post Length 8.6 MM | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Retention Within Housing Without | Contact Layout Inline | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 80 MIC Other 1744428-8
3D model available
Symbol and footprint available
 3
1 Download Model
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1744427-8 TE Connectivity
1 Body Features: Primary Product Color Natural | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 8 | Connector Contact Load Condition Fully Loaded | Contact Features: Contact Underplating Material Nickel | Contact Underplating Material Thickness 50 MICIN | Mating Square Post Dimension .045 INCH | Contact Base Material Brass | Contact Mating Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Thickness 39.37 MICIN | Contact Mating A Other 1744427-8
3D model available
Symbol and footprint available
 3
1 Download Model
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1-1744427-0 TE Connectivity
This part was updated within the past 30 days.
Set alerts for model updates on the part download page.
1 Configuration Features: Number of Rows 1 | Number of Power Positions 10 | PCB Mount Orientation Vertical | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness 1 MICM | Contact Retention Within Housing Without | Contact Base Material Brass | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 39.37 MICIN | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickne Other 1-1744427-0
3D model available
Symbol and footprint available
 3
1 Download Model
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1744427-6 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Positions 6 | Number of Rows 1 | Number of Power Positions 6 | Contact Features: Contact Current Rating (Max) 8 AMP | PCB Contact Termination Area Plating Material Thickness 39.37 MICIN | PCB Contact Termination Area Plating Material Thickness 1 MICM | Contact Retention Within Housing Without | Contact Base Material Brass | Contact Mating Area Plating Material Thickness 39.37 MICIN | Contact Layout Inline | Contact Mating Area Plating Materi Other 1744427-6
3D model available
Symbol and footprint available
 3
1 Download Model
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1744427-3 TE Connectivity
1 Configuration Features: Number of Positions 3 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 3 | Contact Features: PCB Contact Termination Area Plating Material Thickness 1 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 1 MICM | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 8 AMP | PCB Contact Termination Area Plating Material Thickness 39.37 MICIN | Contact Mating Area Plating Material Thickness 39.37 MICIN | Contact Base Other 1744427-3
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1586893-3 TE Connectivity
1 Configuration Features: Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 3 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Type Socket | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Electrical Characteristics: Other 1586893-3
3D model available
Symbol and footprint available
 3
1 Download Model
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1969817-1 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 9 | Number of Rows 3 | Number of Positions 9 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Type Socket | Dimensions: Row-to-Row Spacing Other 1969817-1
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1744446-3 TE Connectivity
1 Economy Power 2.5, PCB Mount Header, Right Angle, Wire-to-Board, 3 Position, 2.5mm [.098in] Centerline, 1 Row, Tin, Natural Housing Color Other 1744446-3
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1744428-3 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 3 | Number of Signal Positions 0 | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Mating Area Plating Material Tin | Contact Base Material Brass | Mating Post Length 8.6 MM | Contact Retention Other 1744428-3
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1744427-2 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 1 MICM | Contact Mating Area Plating Material Thickness 39.37 MICIN | Contact Base Material Brass | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 39.37 MICIN | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickn Other 1744427-2
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
JJEV0UG380NONMRTR TE Connectivity
1 Body Features: Actuator Force 60 G | Product Orientation Vertical | Actuator Color Gray | Actuator Force 2.11 OZ | Actuator Material Thermoplastic | Configuration Features: ESD Grounding Terminal Without | Operating Function Off (On) | Configuration (Pole-Throw) Single Pole - Single Throw | Ganged Without | Number of Actuators Single | Switch Feedback Type Non-Tactile | Contact Features: Contact Base Material Stainless Steel | Switch Contact Plating Material Silver | Contact Current Rating 1 MAMP | Housing Other JJEV0UG380NONMRTR
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1744428-4 TE Connectivity
1 Configuration Features: Number of Signal Positions 0 | Number of Power Positions 4 | Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 8 AMP | Mating Post Length .339 INCH | Contact Mating Area Plating Material Thickness 80 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 80 MICIN | Mating Post Length 8.6 Header, Unshrouded - Right Angle PTH Pin 1744428-4
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1744428-2 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Contact Features: Mating Post Length .339 INCH | Contact Base Material Brass | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 80 MICIN | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plati Other 1744428-2
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1969803-1 TE Connectivity
1 Configuration Features: Number of Positions 3 | Number of Rows 1 | Number of Power Positions 3 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Pre-Tin | Housin Other 1969803-1
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1969808-1 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Positions 5 | Number of Power Positions 5 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: Ope Other 1969808-1
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1969806-1 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max) 12 AMP | Contact Type Socket | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Electrical Characteristics: Other 1969806-1
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1744439-6 TE Connectivity
1 Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 6 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 4.2 AMP | Mating Pin Diameter .6 MM | PCB Contact Termination Area Plating Material Thickness 80 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Other 1744439-6
3D model available
Symbol and footprint available
 3
1 Download Model
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