MMSZ4 Model Download Search Results
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MMSZ4691WS
PANJIT
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1 | Zener Diodes - MMSZ4691WS , 200mW, 5V, 6.275, SOD-323 | Small Outline Diode Flat Lead | MMSZ4691WS |
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MMSZ4691-TP-A003
MCC
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1 | VZ – Tolerance ± 5%• High Reliability• Halogen Free. “Green” Device (Note 1)• Moisture Sensitivity Level 1• Epoxy Meets UL 94 V-0 Flammability Rating• Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHSCompliant. See Ordering Information) | Small Outline Diode | MMSZ4691-TP-A003 |
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MMSZ4704-13P
MCC
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1 | Zener Diode 17 V 500 mW ±5% Surface Mount SOD-123 | Small Outline Diode | MMSZ4704-13P |
3
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MMSZ4685-TP-B002
MCC
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1 | 500 mWZener Diode1.8 to 39 Volts | Small Outline Diode | MMSZ4685-TP-B002 |
3
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MMSZ4690-TP-B002
MCC
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1 | Zener Diodes | Small Outline Diode | MMSZ4690-TP-B002 |
3
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MMSZ4702WS-AU
PANJIT
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1 | Zener Diodes - MMSZ4702WS-AU , AEC-Q101, 200mW, 5V, 156.8, SOD-323 | Small Outline Diode Flat Lead | MMSZ4702WS-AU |
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MMSZ4692WS-AU
PANJIT
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1 | Zener Diodes - MMSZ4692WS-AU , AEC-Q101, 200mW, 5V, 6.86.2, SOD-323 | Small Outline Diode Flat Lead | MMSZ4692WS-AU |
3
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MMSZ4678 RHG
Taiwan Semiconductor
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1 | Zener Diodes SOD-123, 500mW, 5%, Small Signal Zener Diode | Small Outline Diode | MMSZ4678 RHG |
2
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MMSZ4701-TP-B002
MCC
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1 | 500 mWZener Diode1.8 to 39 Volts | Small Outline Diode | MMSZ4701-TP-B002 |
3
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MMSZ4691WS-AU
PANJIT
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1 | Zener Diodes - MMSZ4691WS-AU , AEC-Q101, 200mW, 5V, 6.215, SOD-323 | Small Outline Diode Flat Lead | MMSZ4691WS-AU |
3
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MMSZ4688-V-GS08
Vishay
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1 | VISHAY - MMSZ4688-V-GS08. - ZENER DIODE | Small Outline Diode | MMSZ4688-V-GS08 |
3
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MMSZ4687-13P
MCC
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1 | Zener Diode 4.3 V 500 mW ±5% Surface Mount SOD-123 | Small Outline Diode | MMSZ4687-13P |
3
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MMSZ4683-13P
MCC
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1 | 500 mWZener Diode1.8 to 39 Volts | Small Outline Diode | MMSZ4683-13P |
3
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SZMMSZ4689T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | SZMMSZ4689T1G |
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SZMMSZ4V3T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit | Diodes Moulded | SZMMSZ4V3T1G |
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SZMMSZ4702T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | SZMMSZ4702T1G |
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SZMMSZ4704T3G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | SZMMSZ4704T3G |
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SZMMSZ4683T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | SZMMSZ4683T1G |
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SZMMSZ43T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | SZMMSZ43T1G |
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SZMMSZ4681T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | SZMMSZ4681T1G |
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SZMMSZ4701T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | SZMMSZ4701T1G |
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SZMMSZ4715T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | SZMMSZ4715T1G |
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SZMMSZ4685T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | SZMMSZ4685T1G |
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SZMMSZ4711T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | SZMMSZ4711T1G |
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SZMMSZ4708T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | SZMMSZ4708T1G |
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