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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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P6SMB56AS
PANJIT
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1 | Transient Voltage Suppressors - P6SMB56AS , UNI, 600W, Min.47.8V, Max.58.8V, SMB | Diodes Moulded | P6SMB56AS |
3
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TPSMB51A
LITTELFUSE
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1 | Automotive, Surface Mount 600 W in DO-214AA, Uni-Directional | Other | TPSMB51A |
3
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85_SMB-50-0-1/111_NE
HUBER & SUHNER
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1 | RF Connectors / Coaxial Connectors SMB right angle PCB jack(f) | Other | 85_SMB-50-0-1/111_NE |
2
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SZP6SMB51CAT3G
LITTELFUSE
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1 | Diode TVS Single Bi-Dir 43.6V 600W Automotive AEC-Q101 2-Pin SMB T/R | Diodes Moulded Non Polarised | SZP6SMB51CAT3G |
3
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1PGSMB5934
Taiwan Semiconductor
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1 | Zener Diodes 3000mW, 5%, Zener Diode | Diodes Moulded | 1PGSMB5934 |
3
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1SMB58AT3G
onsemi
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1 | ON Semiconductor 1SMB58AT3G Uni-Directional TVS Diode, 600W peak, 2-Pin SMB | Diodes Moulded Non Polarised | 1SMB58AT3G |
3
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SZ1SMB5.0AT3G
LITTELFUSE
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1 | ESD Suppressors / TVS Diodes 5V 600W UNI-DIR SZ1SMB AEC-Q101 | Diodes Moulded | SZ1SMB5.0AT3G |
3
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1SMB5928B-13
Diodes Incorporated
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1 | Zener Diodes 3.0W SM POWER ZENER 6.2V 39V 200mA 1.2 | Other | 1SMB5928B-13 |
3
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P6SMB510A
Bourns
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1 | ESD Suppressors / TVS Diodes 510V 600W UniDir | Diodes Moulded | P6SMB510A |
3
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1SMB5939B-13
Diodes Incorporated
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1 | Zener Diodes 3.0W SM POWER ZENER 6.2V 39V 200mA 1.2 | Diodes Moulded | 1SMB5939B-13 |
3
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1.5SMB56CA
LITTELFUSE
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1 | ESD Suppressors / TVS Diodes TVS DIODE 1500W | Diodes Moulded Non Polarised | 1.5SMB56CA |
3
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1KSMB56CA
LITTELFUSE
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1 | ESD Protection Diodes / TVS Diodes 56V 1KW 5% BiDirectional | Diodes Moulded Non Polarised | 1KSMB56CA |
3
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1SMB5950 R5G
Taiwan Semiconductor
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1 | DIODE ZENER 110V 3W DO214AA | Diodes Moulded | 1SMB5950 R5G |
3
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1SMB5921BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5921BT3G |
3
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SZ1SMB5921BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5921BT3G |
3
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TPSMB51CA-E
LITTELFUSE
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1 | TVS Diode, Surface Mount ? 600 W, Bi-directional, DO-214AA | Other | TPSMB51CA-E |
3
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1SMB5952BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5952BT3G |
3
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1SMB5935
PANJIT
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1 | Zener Diodes - 1SMB5935 , 1500mW, 5V, 2724, SMB | Diodes Moulded | 1SMB5935 |
3
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1SMB5954BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5954BT3G |
3
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1SMB5929BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5929BT3G |
3
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SZ1SMB5927BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Other | SZ1SMB5927BT3G |
3
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1SMB5956BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5956BT3G |
3
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SZ1SMB5926BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5926BT3G |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TPSMB56CA-E
LITTELFUSE
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1 | TVS Diode, Surface Mount ? 600 W, Bi-directional, DO-214AA | Other | TPSMB56CA-E |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SZ1SMB5940BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5940BT3G |
3
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