2-170 Model Download Search Results
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LTC2170IUKG-14PBF
Analog Devices
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1 | 80Msps Low Power Quad ADCs | Quad Flat No-Lead | LTC2170IUKG-14PBF |
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322170244000
FINDER
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1 | FINDER 32 Series Subminiature PCB relays 6 A | Other | 322170244000 |
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OPA2170AIDGK
Texas Instruments
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1 | 36V, microPower, Rail-to-Rail Output, Dual, General Purpose Op Amp in microPackage | Small Outline Packages | OPA2170AIDGK |
3
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MAL217056331E3
Vishay
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1 | Aluminium Electrolytic Capacitors - Radial Leaded 330uF 20% 25V 10 x 12 | Capacitor, Polarized Radial Diameter | MAL217056331E3 |
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OPA2170AQDGKRQ1
Texas Instruments
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1 | Automotive 36V, microPower, Rail-to-Rail Output, General Purpose Op Amp in MicroPackages | Small Outline Packages | OPA2170AQDGKRQ1 |
3
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32.21.7.012.4000
FINDER
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1 | Relay: electromagnetic; SPDT; Ucoil: 12VDC; Icontacts max: 15A | Other | 32.21.7.012.4000 |
3
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MTSW-217-08-T-D-300
SAMTEC
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1 | Connector Header Through Hole 34 position 0.200" (5.08mm) | Header, Vertical | MTSW-217-08-T-D-300 |
3
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TSW-217-08-G-S
SAMTEC
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1 | THROUGH-HOLE.025" SQ POST HEADER 17 position 5.08 mm pitch. | Other | TSW-217-08-G-S |
3
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8830E-032-170SD-F
KEL CORPORATION
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1 | 8830E-032-170SD-F | Other | 8830E-032-170SD-F |
3
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TPS62170DSGR
Texas Instruments
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1 | 3–17V 0.5A Step-Down Converter with DCS-Control in 2x2 QFN package | Small Outline No-lead | TPS62170DSGR |
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TPS652170RSLR
Texas Instruments
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1 | User programmable power management IC (PMIC) w/ 3 DC/DCs, 4 LDOs, battery charger & LED driver | Quad Flat No-Lead | TPS652170RSLR |
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C0402C223K5RAC31217042
Yageo Group
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1 | .022UF 50.0V | Capacitor Chip Non-polarised | C0402C223K5RAC31217042 |
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OPA2170AIDCUR
Texas Instruments
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1 | 36V, microPower, Rail-to-Rail Output, Dual, General Purpose Op Amp in microPackage | Small Outline Packages | OPA2170AIDCUR |
3
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2170640081
Molex
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1 | Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 8 Circuits, Tin-Bismuth Plating, Black | Other | 2170640081 |
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M22-2021705
Harwin
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1 | M22: 17+17 Pos Plug DIL Straight 3.4mm THT Connector 3.5mm pin Gold | Other | M22-2021705 |
3
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2170704-5
TE Connectivity
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1 | Body Features: Heat Sink Height Class SAN | Heat Sink Height .256 INCH | Heat Sink Style Pin | Heat Sink Finish Anodized Black | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Number of Rear EONs per Port Column 0 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recommended) 1.57 MM | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Cage Material Nickel Silver | Indu | Other | 2170704-5 |
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2170630057
Molex
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1 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 5 Circuits, Tin-Bismuth Plating, Black, with Potting Capability, with Cover Tape | Other | 2170630057 |
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2170136-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Shield Material Brass | Shield Plating Material Nickel | Connector Profile Standard | Configuration Features: Number of PCB Ground Tabs 4 | PCB Mount Orientation Right Angle | Port Configuration Single Port | Number of Loaded Positions 8 | Port Matrix Configuration 1 x 1 | Status Light Type Not Illuminated | Connector Contact Density Standard | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Gold Fl | Other | 2170136-1 |
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2170088-1
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Electrical Characteristics: Data Rate (Max) 32 GBS | Housing Features: Centerline (Pitch) .031 INCH | Centerline (Pitch) .8 MM | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Pluggable I/O Applications SFP+ | Circuit Application Power & Signal | Other: Included Lightpipe No | Packaging Features: | Other | 2170088-1 |
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2170902-1
TE Connectivity
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1 | HM-EZD+,4PAIRS,10COLS,VERTICAL,ASSEMBLY | Other | 2170902-1 |
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LTC2170CUKG-14#PBF
Analog Devices
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1 | 14-Bit, 25Msps Low Power Quad ADCs | Quad Flat No-Lead | LTC2170CUKG-14#PBF |
3
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2092-1708
Wago
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1 | THT pin strip; 1.4 mm Ø solder pin; straight; Pin spacing 5 mm; 8-pole | Other | 2092-1708 |
3
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LTC2170IUKG-14#PBF
Analog Devices
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1 | 14-Bit, 25Msps Low Power Quad ADCs | Quad Flat No-Lead | LTC2170IUKG-14#PBF |
3
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1217057-1
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Thickness 150 MICIN | Terminal Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Underplating Material Thickness 2.54 MICM | Terminal Orientation Straight | Mating Tab Thickness .81 MM | PCB Terminal Type Tab | Terminal Size 4.75 | Mating Tab Width 4.75 MM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Underplating Material Copper | PCB Contact Termination Area Plating Material Thick | Other | 1217057-1 |
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B72500E2170S160
TDK
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1 | Chip Varistors / Ceramic Transient Voltage Suppressors, Maximum continuous voltage=22V, Maximum Clamping Voltage (8/20μs)=50V | Varistors Chip | B72500E2170S160 |
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