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1586039-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 6 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Current Rating (Max) 9 AMP | Contact Type Pin | Dimensions: | Other | 1586039-6 |
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1586040-8
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 8 Position, 4.2 mm [.165 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Power, Natural | Other | 1586040-8 |
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1586038-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Contact Layout Inline | Contact Layout Matrix | Contact Type Pin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Current Rating (M | Other | 1586038-6 |
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1586038-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Matrix | Contact Layo | Header, Shrouded - Straight PTH Box | 1586038-8 |
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1586041-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Layout Matrix | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Type Pin | Contact Retention Within Housing Without | Contact L | Other | 1586041-8 |
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1586039-2
TE Connectivity
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1 | TE Connectivity VAL-U-LOK, 4.2mm Pitch, 2 Way, 2 Row, Straight PCB Header | Other | 1586039-2 |
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1586042-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Square Grid | Contact Layout Matrix | Contact Mating Area Plating Material Tin | Contact Cu | Header, Shrouded - Right Angle PTH Box | 1586042-4 |
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1586076-1
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Rows 1 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing Without | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Mater | Other | 1586076-1 |
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1586037-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Layout Inline | Contact Type Pin | Contact Current Rating (Max) 9 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Dimensions: | Header, Shrouded - Straight PTH Box | 1586037-2 |
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1586040-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inline | Dimensions: Compatible Insula | Other | 1586040-2 |
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1586042-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inline | Contact Type Pin | Dimensions: Compatible Ins | Header, Shrouded - Right Angle PTH Box | 1586042-2 |
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1586037-8
TE Connectivity
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1 | Configuration Features: Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 8 | Contact Features: Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 – | Header, Shrouded - Straight PTH Box | 1586037-8 |
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1586041-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 9 AMP | Dimension | Other | 1586041-2 |
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1586041-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Contact Features: Contact Retention Within Housing Without | Contact Layout Matrix | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Layout Square Grid | PCB Contact Termination Area Plating Material | Header, Shrouded - Right Angle PTH Box | 1586041-4 |
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1586037-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 4 | Number of Power Positions 4 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Tin | Contact Layout Matrix | Contact Type Pin | Contact Layout Square Grid | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Co | Header, Shrouded - Straight PTH Box | 1586037-4 |
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1586037-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 – | Header, Shrouded - Straight PTH Box | 1586037-6 |
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1586041-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.03 â | Other | 1586041-6 |
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1-1586037-6
TE Connectivity
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1 | Rectangular Power Connectors, Header, Plug, Wire-to-Board, 16 Position, 4.2 mm [.165 in] Centerline, Printed Circuit Board, UL 94V-2 | Other | 1-1586037-6 |
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2-1586041-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Rows 2 | Number of Power Positions 24 | Contact Features: Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Layout Inline | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Current Rating (Max) 9 AMP | PCB Contact Termination Area Plating Material Tin | Contact Layout Matrix | | Header, Receptacle - Right Angle PTH Box | 2-1586041-4 |
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1-1586042-0
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 10 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Other | 1-1586042-0 |
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1-1586042-2
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 12 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Header, Receptacle - Right Angle PTH Box | 1-1586042-2 |
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1-1586041-2
TE Connectivity
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1 | 12w r/a pin header | Other | 1-1586041-2 |
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1-1586041-6
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 16 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Header, Shrouded - Right Angle PTH Box | 1-1586041-6 |
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2-1586037-0
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 20 Position, 4.2 mm [.165 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, Power, Natural, Bag | Other | 2-1586037-0 |
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1-1586041-8
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 18 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Other | 1-1586041-8 |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/015/860/396/1586039-6-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/015/860/396/1586039-6-t1.jpg/jcr:content/renditions/product-details.png",null])
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