2-145 Model Download Search Results
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LTC2145IUP-14#PBF
Analog Devices
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1 | 14 Bit Analog to Digital Converter 2 Input 2 Pipelined 64-QFN (9x9) | Quad Flat No-Lead | LTC2145IUP-14#PBF |
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LTC2145IUP-14#TRPBF
Analog Devices
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1 | 14 Bit Analog to Digital Converter 2 Input 2 Pipelined 64-QFN (9x9), 1.7V ~ 1.9V, -40°C ~ 85°C | Quad Flat No-Lead | LTC2145IUP-14#TRPBF |
3
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MS-262-021-455-220R
Molex
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0 | D-Sub MIL Spec Connectors Low Profile BoardMnt R/A 2 Row .050" | Other | MS-262-021-455-220R |
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MS-263-021-455-220R
Molex
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0 | D-Sub MIL Spec Connectors Low Profile BoardMnt R/A 2 Row .050" | Other | MS-263-021-455-220R |
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2SK2145
Toshiba
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1 | N-ch x 2 Junction FET, -50 V, 1.2 to 14 mA, SOT-25(SMV) | Other | 2SK2145 |
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MS-263-021-455-220S
Molex
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0 | D-Sub MIL Spec Connectors Low Profile BoardMnt R/A 2 Row .050" | Other | MS-263-021-455-220S |
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2214574-3
TE Connectivity
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1 | Configuration Features: Number of Rear EONs per Port Column 0 | Number of Ports 4 | Number of Positions 152 | Port Matrix Configuration 2 x 2 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Electrical | Other | 2214574-3 |
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2214574-4
TE Connectivity
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1 | Configuration Features: Number of Positions 152 | Number of Ports 4 | Number of Rear EONs per Port Column 0 | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Gold | Contact Underplating Material Tin | Dimensions: PCB Thickness (Recommended) 1.57 MM | Electrical Characteristics: Data Rate (Max) 14 GBS | Other | 2214574-4 |
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214552-E
TE Connectivity
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1 | PCB Mount Plug, Vertical, Board-to-Board, 5 Position, 2 mm [.079 in] Centerline, Fully Shrouded, Gold (Au), ERNI MicroSpeed Power Modules | Other | 214552-E |
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TMSB 2-2145
Traco Power
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1 | 2 Watt AC/DC modules, industrial/household, 85-264 VAC input, standby power module, constant power characteristics at 2W (no current limitation), encapsulated, PCB mount | Other | TMSB 2-2145 |
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1821452
Phoenix Contact
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1 | MCV 0,5/ 8-G-2,54 P20 THR R44 - PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 8, number of rows: 1, number of positions: 8, number of connections: 8, product range: MCV 0,5/..-G-THR, pitch: 2.54 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 0,5 | Other | 1821452 |
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2214574-1
TE Connectivity
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1 | Configuration Features: Number of Rear EONs per Port Column 0 | Port Matrix Configuration 2 x 2 | Number of Ports 4 | Number of Positions 152 | Contact Features: Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Electrical | Other | 2214574-1 |
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2214593-2
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Rear EONs per Port Column 3 | Number of Positions 152 | Number of Ports 4 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | Other | 2214593-2 |
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722-145/031-000
Wago
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1 | THT female header; straight; Pin spacing 5 mm; 15-pole; 100% protected against mismating; clamping collar; 0.6 x 1.0 mm solder pin | Other | 722-145/031-000 |
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232-145
Wago
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1 | THT female header; straight; Pin spacing 5 mm; 15-pole; 0.6 x 1.0 mm solder pin | Other | 232-145 |
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46556-2145
Molex
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1 | Molex SEARAY* Series, Series Number 46556, 1.27mm Pitch 80 Way 4 Row Straight PCB Header, Solder Termination, 1A | Other | 46556-2145 |
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LM822-1459
LM TECHNOLOGIES
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1 | WLAN MODULE, 3V, USB, 2.4GHZ; Frequency RF:2.4GHz; Module Interface:USB; Module Applications:Wireless Connectivity; Product Range:LM822 Series; SVHC:No SVHC (15-Jan-2018) RoHS Compliant: Yes | Other | LM822-1459 |
3
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214551
TE Connectivity
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1 | MicroSpeed Male Connector 5-pin, vertical, SMT | Other | 214551 |
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46557-2145
Molex
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1 | Molex SEARAY* Series 1.27mm 80 Way 4 Row Straight PCB Socket Through Hole Board to Board | Other | 46557-2145 |
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1 | D-Sub Micro-D Connectors 14P R/A SHLD RECEPT BOARDMNT M2.5 THREAD | Other | N10214-5212PC |
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1 | D-Sub Micro-D Connectors 14/SDR/T HOLE/RA | Other | 12214-5150-00PL |
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2SK2145-BL(TE85L,F
Toshiba
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1 | JFET N-Ch Junction FET 10mA -50V VGDS | SOT23 (5-Pin) | 2SK2145-BL(TE85L,F |
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2SK2145-GR(TE85L,F
Toshiba
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1 | JFET Junction FET N-Ch x2 1.2 to 14mA 10mA | Other | 2SK2145-GR(TE85L,F |
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52045-2145
Molex
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1 | Molex FFC/FPC THROUGH HOLE Series 1.25mm Pitch 21 Way 1 Row Straight Through Hole Female FPC Connector | Other | 52045-2145 |
3
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214551-E
TE Connectivity
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1 | Rectangular Power Connectors, Connector Assembly, Housing for Male Terminals, Board-to-Board, 5 Position, ERNI MicroSpeed Power Modules | Other | 214551-E |
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![Part Image](["https://componentsearchengine.com/Images/9/LTC2145IUP-14#PBF.jpg",null,null])
![Part Image](["https://componentsearchengine.com/Images/9/LTC2145IUP-14#TRPBF.jpg",null,null])
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