2-145 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2SK2145 Toshiba	1	N-ch x 2 Junction FET, -50 V, 1.2 to 14 mA, SOT-25(SMV)	Other	2SK2145	3D model available Symbol and footprint available 3	1 Download Model
	2214574-4 TE Connectivity	1	Configuration Features: Number of Positions 152 \| Number of Ports 4 \| Number of Rear EONs per Port Column 0 \| Port Matrix Configuration 2 x 2 \| Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness .76 MICM \| PCB Contact Termination Area Plating Material Gold \| Contact Mating Area Plating Material Gold \| Contact Underplating Material Tin \| Dimensions: PCB Thickness (Recommended) 1.57 MM \| Electrical Characteristics: Data Rate (Max) 14 GBS	Other	2214574-4	3D model available Symbol and footprint available 3	1 Download Model
	MS-262-021-455-220R AirBorn	1	D-Sub MIL Spec Connectors Low Profile BoardMnt R/A 2 Row .050"	Other	MS-262-021-455-220R	3D model not available Symbol and footprint available 2	1 Download Model
	MS-263-021-455-220R AirBorn	1	D-Sub MIL Spec Connectors Low Profile BoardMnt R/A 2 Row .050"	Other	MS-263-021-455-220R	3D model not available Symbol and footprint available 2	1 Download Model

	1821452 Phoenix Contact	1	PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, type of contact: Male connector, Number of potentials: 8, Number of rows: 1, Number of positions per row: 8, number of connections: 8, product range: MCV 0,5/..-G-THR, pitch: 2.54 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, Stecksystem: MICRO COMBICON - FMC 0,5, Locking: without, type of packaging: 44 mm wide tape, Sample values available und	Other	1821452	3D model available Symbol and footprint available 3	1 Download Model
	2214574-3 TE Connectivity	1	Configuration Features: Number of Rear EONs per Port Column 0 \| Number of Ports 4 \| Number of Positions 152 \| Port Matrix Configuration 2 x 2 \| Contact Features: PCB Contact Termination Area Plating Material Gold \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Underplating Material Tin \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Gold \| Dimensions: PCB Thickness (Recommended) 1.57 MM \| PCB Thickness (Recommended) .062 INCH \| Electrical	Other	2214574-3	3D model available Symbol and footprint available 3	1 Download Model
	MS-263-021-455-220S AirBorn	1	D-Sub MIL Spec Connectors Low Profile BoardMnt R/A 2 Row .050"	Other	MS-263-021-455-220S	3D model not available Symbol and footprint available 2	1 Download Model
	662102145021 Würth Elektronik	1	WURTH ELEKTRONIK - 662102145021 - Rectangular Power Connector, 2 Contacts, WR-MPC3 Series, PCB Mount, Surface Mount, 3 mm, Header	Other	662102145021	3D model available Symbol and footprint available 3	1 Download Model
	TMSB 2-2145 Traco Power	1	2 Watt AC/DC modules, industrial/household, 85-264 VAC input, standby power module, constant power characteristics at 2W (no current limitation), encapsulated, PCB mount	Other	TMSB 2-2145	3D model available Symbol and footprint available 3	1 Download Model
	2214574-1 TE Connectivity	1	Configuration Features: Number of Rear EONs per Port Column 0 \| Port Matrix Configuration 2 x 2 \| Number of Ports 4 \| Number of Positions 152 \| Contact Features: Contact Underplating Material Tin \| Contact Mating Area Plating Material Thickness .76 MICM \| PCB Contact Termination Area Plating Material Gold \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Mating Area Plating Material Gold \| Dimensions: PCB Thickness (Recommended) 1.57 MM \| PCB Thickness (Recommended) .062 INCH \| Electrical	Other	2214574-1	3D model available Symbol and footprint available 3	1 Download Model
	2214593-2 TE Connectivity	1	Configuration Features: Port Matrix Configuration 2 x 2 \| Number of Rear EONs per Port Column 3 \| Number of Positions 152 \| Number of Ports 4 \| Contact Features: PCB Contact Termination Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Underplating Material Tin \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness 30 MICIN \| Dimensions: PCB Thickness (Recommended) 1.57 MM \| PCB Thickness	Other	2214593-2	3D model available Symbol and footprint available 3	1 Download Model
	68711214522 Würth Elektronik	1	WURTH ELEKTRONIK - 68711214522 - FFC / FPC Board Connector, ZIF, 0.5 mm, 12 Contacts, Plug, Surface Mount, Bottom	Other	68711214522	3D model available Symbol and footprint available 3	1 Download Model
	10214-55G3PC 3M	1	3M MDR 102 Series, 14 Way Right Angle Through Hole Mount Micro-D PCB Connector Socket, 1.27mm Pitch	Other	10214-55G3PC	3D model available Symbol and footprint available 3	1 Download Model
	2SK2145-GR(TE85L,F Toshiba	1	JFET Junction FET N-Ch x2 1.2 to 14mA 10mA	Other	2SK2145-GR(TE85L,F	3D model available Symbol and footprint available 3	1 Download Model
	2SK2145-BL(TE85L,F Toshiba	1	JFET N-Ch Junction FET 10mA -50V VGDS	SOT23 (5-Pin)	2SK2145-BL(TE85L,F	3D model not available Symbol and footprint available 2	1 Download Model

	52045-2145 Molex	1	Molex FFC/FPC THROUGH HOLE Series 1.25mm Pitch 21 Way 1 Row Straight Through Hole Female FPC Connector	Other	52045-2145	3D model available Symbol and footprint available 3	1 Download Model
	N10214-5212PC 3M	1	D-Sub Micro-D Connectors 14P R/A SHLD RECEPT BOARDMNT M2.5 THREAD	Other	N10214-5212PC	3D model available Symbol and footprint available 3	1 Download Model
	12214-5150-00PL 3M	1	D-Sub Micro-D Connectors 14/SDR/T HOLE/RA	Other	12214-5150-00PL	3D model available Symbol and footprint available 3	1 Download Model
	46557-2145 Molex	1	Molex SEARAY* Series 1.27mm 80 Way 4 Row Straight PCB Socket Through Hole Board to Board	Other	46557-2145	3D model available Symbol and footprint available 3	1 Download Model
	141352145000 Würth Elektronik	1	Optocoupler Darlington	Small Outline Packages	141352145000	3D model available Symbol and footprint available 3	1 Download Model
	ACPL-214-500E Avago Technologies	1	Broadcom, ACPL-214-500E AC Input Transistor Output Optocoupler, Surface Mount, 4-Pin SOIC	Small Outline Packages	ACPL-214-500E	3D model available Symbol and footprint available 3	1 Download Model
	OPA2145IDR Texas Instruments	1	Operational Amplifiers - Op Amps Dual, 5.5-MHz, high slew rate, low-noise, low-power, RRO precision JFET operational amplifier	Small Outline Packages	OPA2145IDR	3D model available Symbol and footprint available 3	1 Download Model
	LTC2145IUP-12#PBF Analog Devices	1	IC ADC DUAL 12BIT 125MSPS 64QFN	Quad Flat No-Lead	LTC2145IUP-12#PBF	3D model available Symbol and footprint available 3	1 Download Model
	44472-1454 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 14 Circuits, PA Polyamide Nylon 6/6 94V-0	Other	44472-1454	3D model available Symbol and footprint available 3	1 Download Model
	R5F72145HDBG#U1 Renesas Electronics	1	The SH7216 Series with 32-bit SH-2A CPU core offers a maximum operating frequency of 200 MHz, representing a 1.25-fold improvement in performance over the 160 MHz of Renesas Electronics's existing the SH7211. They also include large-capacity high-speed flash memory and RAM through the use of cutting-edge flash memory technology. Featuring an on-chip power supply step-down circuit, these microcontrollers are designed to achieve lower current dissipation by suppressing the increase in current dissipation asso	BGA	R5F72145HDBG#U1	3D model available Symbol and footprint available 3	1 Download Model
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