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2308107-9
TE Connectivity
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1 | Body Features: Ejector Location Both Ends | PCB Retention Feature Material Stainless Steel | Ejector Material High Temperature Thermoplastic | Ejector Material Color Natural | Ejector Type Standard | Module Key Type Offset Right | Latch Color Natural | Latch Material High Temperature Thermoplastic | Connector Profile Standard | Configuration Features: Number of Keys 1 | Number of Positions 288 | Module Orientation Vertical | Number of Rows 2 | Contact Features: Contact Base Material Copper Alloy | Socket St | Other | 2308107-9 |
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2308-1HDCGI8
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-1HDCGI8 |
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3404.2308.11
SCHURTER
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1 | 630 mA 125 V AC 125 V DC Fuse Board Mount (Cartridge Style Excluded) Requires Holder, Surface Mount 2-SMD, Square End Block with Holder | Other | 3404.2308.11 |
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2308-1HDCG
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-1HDCG |
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2308-1HPGGI
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-1HPGGI |
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2308-1DCG
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-1DCG |
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2308-1DCG8
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-1DCG8 |
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2308-1DCGI8
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-1DCGI8 |
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SMS3923-081LF
Skyworks
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1 | Schottky Diodes & Rectifiers Ls=1.8nH SC-88 Dual Series Pair | SOT23 (6-Pin) | SMS3923-081LF |
3
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2308-1HPGG8
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-1HPGG8 |
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2308-1HDCG8
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-1HDCG8 |
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2308-1HPGGI8
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-1HPGGI8 |
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2308-1HPGG
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-1HPGG |
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1823081
Phoenix Contact
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1 | PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 320 V, nominal cross section: 1.5 mm?, Number of potentials: 2, Number of rows: 1, Number of positions per row: 2, product range: SPT 1,5/..-H-THR, pitch: 5.08 mm, connection method: Push-in spring connection, mounting: THR soldering, conductor/PCB connection direction: 0 ?, color: black, Pin layout: Linear double pinning, Solder pin [P]: 2.6 mm, type of packaging: packed in cardboard | Other | 1823081 |
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2308-1DCGI
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-1DCGI |
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2308107-3
TE Connectivity
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1 | Body Features: PCB Retention Feature Material Stainless Steel | Ejector Material Color Natural | Ejector Type Standard | Latch Material High Temperature Thermoplastic | Latch Color Natural | Module Key Type Offset Right | Ejector Material High Temperature Thermoplastic | Connector Profile Standard | Ejector Location Both Ends | Configuration Features: Module Orientation Vertical | Number of Keys 1 | Number of Rows 2 | Number of Positions 288 | Contact Features: Memory Socket Type Memory Card | Contact Matin | 2308107-3 |
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2308171-7
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Rear EONs per Port Column 0 | Number of Positions 152 | Number of Ports 4 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICIN | Contact Mating Area Plating Material Thickness 30 MICM | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) 3 MM | PCB Thickness (Recommended) .118 INCH | Housing Featu | 2308171-7 |
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2308107-1
TE Connectivity
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1 | Body Features: Ejector Material High Temperature Thermoplastic | Latch Material High Temperature Thermoplastic | PCB Retention Feature Material Stainless Steel | Ejector Location Both Ends | Connector Profile Standard | Ejector Material Color Black | Latch Color Black | Ejector Type Standard | Module Key Type Offset Right | Configuration Features: Number of Keys 1 | Number of Rows 2 | Number of Positions 288 | Module Orientation Vertical | Contact Features: Contact Current Rating (Max) .75 AMP | Contact Mat | 2308107-1 |
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2308171-6
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Positions 152 | Number of Rear EONs per Port Column 0 | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICM | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICIN | Dimensions: PCB Thickness (Recommended) .118 INCH | PCB Thickness (Recommended) 3 MM | Housing Featu | 2308171-6 |
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2308171-4
TE Connectivity
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1 | Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Number of Positions 152 | Number of Rear EONs per Port Column 0 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICM | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) .118 INCH | PCB Thickness (Recommended) 3 MM | Housing Featu | 2308171-4 |
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2308171-2
TE Connectivity
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1 | Configuration Features: Number of Positions 152 | Number of Rear EONs per Port Column 0 | Number of Ports 4 | Port Matrix Configuration 2 x 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICM | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICIN | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 3 MM | PCB Thickness (Recommended) .118 INCH | Housing Featu | 2308171-2 |
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2308171-9
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Rear EONs per Port Column 0 | Number of Ports 4 | Number of Positions 152 | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICM | Contact Mating Area Plating Material Thickness .76 MICIN | Dimensions: PCB Thickness (Recommended) 3 MM | PCB Thickness (Recommended) .118 INCH | Housing Featu | 2308171-9 |
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2308107-7
TE Connectivity
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1 | Body Features: Ejector Material High Temperature Thermoplastic | Ejector Type Standard | Module Key Type Offset Right | Latch Material High Temperature Thermoplastic | Connector Profile Standard | Latch Color Natural | Ejector Material Color Natural | PCB Retention Feature Material Stainless Steel | Ejector Location Both Ends | Configuration Features: Number of Keys 1 | Module Orientation Vertical | Number of Rows 2 | Number of Positions 288 | Contact Features: Contact Mating Area Plating Material Thickness | 2308107-7 |
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2308171-8
TE Connectivity
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1 | Configuration Features: Number of Positions 152 | Number of Rear EONs per Port Column 0 | Port Matrix Configuration 2 x 2 | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICIN | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) .118 INCH | PCB Thickness (Recommended) 3 MM | Housing Featu | 2308171-8 |
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2308107-6
TE Connectivity
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1 | Body Features: Connector Profile Standard | Ejector Material High Temperature Thermoplastic | Module Key Type Offset Right | Latch Material High Temperature Thermoplastic | Ejector Type Standard | Latch Color Natural | PCB Retention Feature Material Stainless Steel | Ejector Material Color Natural | Ejector Location Both Ends | Configuration Features: Module Orientation Vertical | Number of Keys 1 | Number of Positions 288 | Number of Rows 2 | Contact Features: Memory Socket Type Memory Card | Socket Style | 2308107-6 |
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