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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2308107-9 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Body Features: Ejector Location Both Ends \| PCB Retention Feature Material Stainless Steel \| Ejector Material High Temperature Thermoplastic \| Ejector Material Color Natural \| Ejector Type Standard \| Module Key Type Offset Right \| Latch Color Natural \| Latch Material High Temperature Thermoplastic \| Connector Profile Standard \| Configuration Features: Number of Keys 1 \| Number of Positions 288 \| Module Orientation Vertical \| Number of Rows 2 \| Contact Features: Contact Base Material Copper Alloy \| Socket St	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HPGGI Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HDCGI8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HDCG Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model

	2308-1DCGI Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HPGG Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HPGGI8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	SMS3923-081LF Skyworks	1	Schottky Diodes & Rectifiers Ls=1.8nH SC-88 Dual Series Pair	SOT23 (6-Pin)	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2308-1DCGI8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2308-1DCG8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2308-1DCG Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HPGG8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HDCG8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	1823081 Phoenix Contact	1	PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 320 V, nominal cross section: 1.5 mm?, Number of potentials: 2, Number of rows: 1, Number of positions per row: 2, product range: SPT 1,5/..-H-THR, pitch: 5.08 mm, connection method: Push-in spring connection, mounting: THR soldering, conductor/PCB connection direction: 0 ?, color: black, Pin layout: Linear double pinning, Solder pin [P]: 2.6 mm, type of packaging: packed in cardboard	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2308107-3 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Body Features: PCB Retention Feature Material Stainless Steel \| Ejector Material Color Natural \| Ejector Type Standard \| Latch Material High Temperature Thermoplastic \| Latch Color Natural \| Module Key Type Offset Right \| Ejector Material High Temperature Thermoplastic \| Connector Profile Standard \| Ejector Location Both Ends \| Configuration Features: Module Orientation Vertical \| Number of Keys 1 \| Number of Rows 2 \| Number of Positions 288 \| Contact Features: Memory Socket Type Memory Card \| Contact Matin		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model

	2308171-7 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Configuration Features: Port Matrix Configuration 2 x 2 \| Number of Rear EONs per Port Column 0 \| Number of Positions 152 \| Number of Ports 4 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .76 MICIN \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Current Rating (Max) .5 AMP \| Dimensions: PCB Thickness (Recommended) 3 MM \| PCB Thickness (Recommended) .118 INCH \| Housing Featu		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	2308107-1 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Body Features: Ejector Material High Temperature Thermoplastic \| Latch Material High Temperature Thermoplastic \| PCB Retention Feature Material Stainless Steel \| Ejector Location Both Ends \| Connector Profile Standard \| Ejector Material Color Black \| Latch Color Black \| Ejector Type Standard \| Module Key Type Offset Right \| Configuration Features: Number of Keys 1 \| Number of Rows 2 \| Number of Positions 288 \| Module Orientation Vertical \| Contact Features: Contact Current Rating (Max) .75 AMP \| Contact Mat		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	2308171-4 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Configuration Features: Number of Ports 4 \| Port Matrix Configuration 2 x 2 \| Number of Positions 152 \| Number of Rear EONs per Port Column 0 \| Contact Features: Contact Mating Area Plating Material Thickness .76 MICIN \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Current Rating (Max) .5 AMP \| PCB Contact Termination Area Plating Material Tin \| Dimensions: PCB Thickness (Recommended) .118 INCH \| PCB Thickness (Recommended) 3 MM \| Housing Featu		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	2308171-2 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Configuration Features: Number of Positions 152 \| Number of Rear EONs per Port Column 0 \| Number of Ports 4 \| Port Matrix Configuration 2 x 2 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Thickness .76 MICIN \| Contact Mating Area Plating Material Gold \| Dimensions: PCB Thickness (Recommended) 3 MM \| PCB Thickness (Recommended) .118 INCH \| Housing Featu		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	2308171-9 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Configuration Features: Port Matrix Configuration 2 x 2 \| Number of Rear EONs per Port Column 0 \| Number of Ports 4 \| Number of Positions 152 \| Contact Features: Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Mating Area Plating Material Thickness .76 MICIN \| Dimensions: PCB Thickness (Recommended) 3 MM \| PCB Thickness (Recommended) .118 INCH \| Housing Featu		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	2308171-6 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Configuration Features: Port Matrix Configuration 2 x 2 \| Number of Positions 152 \| Number of Rear EONs per Port Column 0 \| Number of Ports 4 \| Contact Features: Contact Mating Area Plating Material Gold \| PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Thickness .76 MICIN \| Dimensions: PCB Thickness (Recommended) .118 INCH \| PCB Thickness (Recommended) 3 MM \| Housing Featu		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	2308171-8 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Configuration Features: Number of Positions 152 \| Number of Rear EONs per Port Column 0 \| Port Matrix Configuration 2 x 2 \| Number of Ports 4 \| Contact Features: Contact Mating Area Plating Material Thickness 30 MICM \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .76 MICIN \| Contact Current Rating (Max) .5 AMP \| PCB Contact Termination Area Plating Material Tin \| Dimensions: PCB Thickness (Recommended) .118 INCH \| PCB Thickness (Recommended) 3 MM \| Housing Featu		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	2308107-6 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Body Features: Connector Profile Standard \| Ejector Material High Temperature Thermoplastic \| Module Key Type Offset Right \| Latch Material High Temperature Thermoplastic \| Ejector Type Standard \| Latch Color Natural \| PCB Retention Feature Material Stainless Steel \| Ejector Material Color Natural \| Ejector Location Both Ends \| Configuration Features: Module Orientation Vertical \| Number of Keys 1 \| Number of Positions 288 \| Number of Rows 2 \| Contact Features: Memory Socket Type Memory Card \| Socket Style		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	2308107-7 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Body Features: Ejector Material High Temperature Thermoplastic \| Ejector Type Standard \| Module Key Type Offset Right \| Latch Material High Temperature Thermoplastic \| Connector Profile Standard \| Latch Color Natural \| Ejector Material Color Natural \| PCB Retention Feature Material Stainless Steel \| Ejector Location Both Ends \| Configuration Features: Number of Keys 1 \| Module Orientation Vertical \| Number of Rows 2 \| Number of Positions 288 \| Contact Features: Contact Mating Area Plating Material Thickness		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	2308171-3 TE Connectivity This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Configuration Features: Number of Ports 4 \| Number of Positions 152 \| Number of Rear EONs per Port Column 0 \| Port Matrix Configuration 2 x 2 \| Contact Features: Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Mating Area Plating Material Thickness .76 MICIN \| PCB Contact Termination Area Plating Material Tin \| Dimensions: PCB Thickness (Recommended) .118 INCH \| PCB Thickness (Recommended) 3 MM \| Housing Featu		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
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