23081 Footprint, Symbol and 3D Model search results

Showing 25 of 2075 results

Price & Stock Powered by

Filter by Manufacturer

Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2308-1HDCGI8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	2308-1HDCGI8	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HPGGI Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	2308-1HPGGI	3D model available Symbol and footprint available 3	1 Download Model
	2308-1DCGI Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	2308-1DCGI	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HDCG Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	2308-1HDCG	3D model available Symbol and footprint available 3	1 Download Model

	2308-1DCG Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	2308-1DCG	3D model available Symbol and footprint available 3	1 Download Model
	2308-1DCGI8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	2308-1DCGI8	3D model available Symbol and footprint available 3	1 Download Model
	2308-1DCG8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	2308-1DCG8	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HPGGI8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	2308-1HPGGI8	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HPGG Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	2308-1HPGG	3D model available Symbol and footprint available 3	1 Download Model
	2308107-3 TE Connectivity	1	Double Data Rate (DDR) 4, Board-to-Bus Bar, 288 Position, Through Hole - Solder, Vertical Module Orientation, DDR4 DIMM, DIMM Sockets	Other	2308107-3	3D model available Symbol and footprint available 3	1 Download Model
	2308107-1 TE Connectivity	1	Double Data Rate (DDR) 4, Board-to-Bus Bar, 288 Position, Through Hole - Solder, Vertical Module Orientation, DDR4 DIMM, DIMM Sockets	Other	2308107-1	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HPGG8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	2308-1HPGG8	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HDCG8 Renesas Electronics	1	The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i	Small Outline Packages	2308-1HDCG8	3D model available Symbol and footprint available 3	1 Download Model
	2308107-9 TE Connectivity	1	Body Features: Ejector Location Both Ends \| PCB Retention Feature Material Stainless Steel \| Ejector Material High Temperature Thermoplastic \| Ejector Material Color Natural \| Ejector Type Standard \| Module Key Type Offset Right \| Latch Color Natural \| Latch Material High Temperature Thermoplastic \| Connector Profile Standard \| Configuration Features: Number of Keys 1 \| Number of Positions 288 \| Module Orientation Vertical \| Number of Rows 2 \| Contact Features: Contact Base Material Copper Alloy \| Socket St	Other	2308107-9	3D model available Symbol and footprint available 3	1 Download Model
	3404.2308.11 SCHURTER	1	630 mA 125 V AC 125 V DC Fuse Board Mount (Cartridge Style Excluded) Requires Holder, Surface Mount 2-SMD, Square End Block with Holder	Other	3404.2308.11	3D model available Symbol and footprint available 3	1 Download Model

	SMS3923-081LF Skyworks	1	Schottky Diodes & Rectifiers Ls=1.8nH SC-88 Dual Series Pair	SOT23 (6-Pin)	SMS3923-081LF	3D model available Symbol and footprint available 3	1 Download Model
	1823081 Phoenix Contact	1	SPT-THR 1,5/ 2-H-5,08 P26 - Printed circuit board terminal, nominal current: 17.5 A, rated voltage (III/2): 320 V, nominal cross section: 1.5 mm², number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: SPT 1,5/..-H-THR, pitch: 5.08 mm, connection method: Push-in spring connection, mounting: THR soldering / wave soldering, conductor/PCB connection direction: 0 °, color: black, Pin layout: Linear pinning, Solder pin [P]: 2.6 mm, number of solder pins per potentia	Other	1823081	3D model available Symbol and footprint available 3	1 Download Model
	3-582308-1 TE Connectivity	1	Body Features: Primary Product Color Green \| Configuration Features: PCB Mount Orientation Right Angle \| Number of Positions 47 \| Contact Features: Contact Base Material Brass Alloy \| Contact Mating Area Plating Material Gold \| Contact Type Blade \| Dimensions: PCB Thickness (Recommended) 1.6 MM \| PCB Thickness (Recommended) .063 INCH \| Housing Features: Housing Material Diallyl Phthalate \| Centerline (Pitch) 2.54 MM \| Centerline (Pitch) .1 INCH \| Mechanical Attachment: PCB Mount Retention Type Mounting Ears	Other	3-582308-1	3D model available Symbol and footprint available 3	1 Download Model
	2308-1HPG Integrated Device Technology Inc	1	PLL Based Clock Driver, 2308 Series, 8 True Output(s), 0 Inverted Output(s), PDSO16		2308-1HPG	3D model not available Symbol and footprint not available 0	0 Build or Request
	2308-1PGG Integrated Device Technology Inc	1	PLL Based Clock Driver, 2308 Series, 4 True Output(s), 0 Inverted Output(s), PDSO16		2308-1PGG	3D model not available Symbol and footprint not available 0	0 Build or Request
	2308171-7 TE Connectivity	1	Configuration Features: Port Matrix Configuration 2 x 2 \| Number of Rear EONs per Port Column 0 \| Number of Positions 152 \| Number of Ports 4 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .76 MICIN \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Current Rating (Max) .5 AMP \| Dimensions: PCB Thickness (Recommended) 3 MM \| PCB Thickness (Recommended) .118 INCH \| Housing Featu		2308171-7	3D model available Symbol and footprint not available 1	1 Download Model
	2308107-7 TE Connectivity	1	Body Features: Ejector Material High Temperature Thermoplastic \| Ejector Type Standard \| Module Key Type Offset Right \| Latch Material High Temperature Thermoplastic \| Connector Profile Standard \| Latch Color Natural \| Ejector Material Color Natural \| PCB Retention Feature Material Stainless Steel \| Ejector Location Both Ends \| Configuration Features: Number of Keys 1 \| Module Orientation Vertical \| Number of Rows 2 \| Number of Positions 288 \| Contact Features: Contact Mating Area Plating Material Thickness		2308107-7	3D model available Symbol and footprint not available 1	1 Download Model
	2308171-8 TE Connectivity	1	Configuration Features: Number of Positions 152 \| Number of Rear EONs per Port Column 0 \| Port Matrix Configuration 2 x 2 \| Number of Ports 4 \| Contact Features: Contact Mating Area Plating Material Thickness 30 MICM \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .76 MICIN \| Contact Current Rating (Max) .5 AMP \| PCB Contact Termination Area Plating Material Tin \| Dimensions: PCB Thickness (Recommended) .118 INCH \| PCB Thickness (Recommended) 3 MM \| Housing Featu		2308171-8	3D model available Symbol and footprint not available 1	1 Download Model
	2308107-6 TE Connectivity	1	Body Features: Connector Profile Standard \| Ejector Material High Temperature Thermoplastic \| Module Key Type Offset Right \| Latch Material High Temperature Thermoplastic \| Ejector Type Standard \| Latch Color Natural \| PCB Retention Feature Material Stainless Steel \| Ejector Material Color Natural \| Ejector Location Both Ends \| Configuration Features: Module Orientation Vertical \| Number of Keys 1 \| Number of Positions 288 \| Number of Rows 2 \| Contact Features: Memory Socket Type Memory Card \| Socket Style		2308107-6	3D model available Symbol and footprint not available 1	1 Download Model
	2308171-3 TE Connectivity	1	Configuration Features: Number of Ports 4 \| Number of Positions 152 \| Number of Rear EONs per Port Column 0 \| Port Matrix Configuration 2 x 2 \| Contact Features: Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Mating Area Plating Material Thickness .76 MICIN \| PCB Contact Termination Area Plating Material Tin \| Dimensions: PCB Thickness (Recommended) .118 INCH \| PCB Thickness (Recommended) 3 MM \| Housing Featu		2308171-3	3D model available Symbol and footprint not available 1	1 Download Model
1 2 3 4 5 6 7 8 9

Can't find what you're looking for? Request this part

23081 Model Download Search Results

Popular Clock Drivers