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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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555-5007F
Dialight
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1 | LED Circuit Board Indicators 2mm Quad CBI | Other | Check Price & Stock |
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555-5003F
Dialight
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1 | Dialight 555-5003F, Red PCB LED Indicator, 4 LEDs, Through Hole | Other | Check Price & Stock |
3
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555-5401F
Dialight
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1 | LED Circuit Board Indicators YELLOW DIFFUSED | Other | Check Price & Stock |
3
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1755558
Phoenix Contact
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1 | PCB header, nominal cross section: 2.5 mm?, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 6, Number of rows: 1, Number of positions per row: 6, number of connections: 6, product range: MSTBVA 2,5/..-G, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, Stecksystem: CLASSIC COMBICON, Locking: without, type of packaging: packed in cardboard | Other | Check Price & Stock |
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AD5555CRUZ
Analog Devices
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1 | AD5555CRUZ, 14 bit-Bit DAC Dual, 2Msps, SPI, 16-Pin TSSOP | Small Outline Packages | Check Price & Stock |
3
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10155552-A108KLF
Amphenol
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1 | Automotive Connectors Minitek MicroSpaceXS 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Header Vertical, Tin (preplated) | Other | Check Price & Stock |
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IsoM5-555-B-L1
Bourns
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1 | IsoMOV 5KA 555Vrms Bulk Straight | Other | Check Price & Stock |
3
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5555165-5
TE Connectivity
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1 | M/J, LPF, R/A, 6P/2C, TIN, BULK PKG | Other | Check Price & Stock |
3
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5555164-4
TE Connectivity
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1 | Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: PCB Mount Orientation Right Angle | Status Light Type Not Illuminated | Number of Positions 8 | Port Configuration Single Port | Port Matrix Configuration 1 x 1 | Number of Loaded Positions 8 | Connector Contact Density Standard | Contact Features: Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 1.27 MICM | PC | Other | Check Price & Stock |
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5555153-1
TE Connectivity
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1 | Body Features: Shield Material Copper Alloy | Shield Plating Material Tin | Connector Profile Low | PCB Ground Tab Location .12 INCH | PCB Ground Tab Location 3.05 MM | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: PCB Mount Orientation Right Angle | Port Configuration Single Port | Number of PCB Ground Tabs 2 | Number of Positions 8 | Connector Contact Density Standard | Port Matrix Configuration 1 x 1 | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Con | Other | Check Price & Stock |
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5555003-1
TE Connectivity
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1 | MJ,R/A,6P,PNL,RH LTCH,GRY | Other | Check Price & Stock |
3
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5555799-1
TE Connectivity
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1 | Body Features: Connector Profile Standard | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Number of Positions 8 | Port Configuration Single Port | Status Light Type Not Illuminated | Connector Contact Density Standard | Port Matrix Configuration 1 x 1 | PCB Mount Orientation Vertical | Number of Loaded Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Gold | | Other | Check Price & Stock |
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5555162-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 8 | Connector Contact Density Standard | Number of Loaded Positions 8 | Port Configuration Single Port | Port Matrix Configuration 1 x 1 | Status Light Type Not Illuminated | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Mating Area Plating Materi | Other | Check Price & Stock |
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FJD5555TM
onsemi
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1 | Bipolar Transistors - BJT High Volt Fast Switching Trans | Other | Check Price & Stock |
2
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5555140-1
TE Connectivity
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1 | Shielded Mod jack 6/6 panel+pcb Grd SE | Other | Check Price & Stock |
3
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1N5555
Microsemi Corporation
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1 | TVS DIODE 30.5V 47.5V DO13 | Diodes, Axial Diameter Horizontal Mounting | Check Price & Stock |
3
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5055558-4
TE Connectivity
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1 | Body Features: Terminal Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness 3.04 MICM | Contact Current Rating (Max) 37.8 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness .5 – 3.04 MICM | PCB Contact Termination Area Plating Material Thickness 20 – 120 MICIN | PCB Contact Termination A | Other | Check Price & Stock |
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5555149-1
TE Connectivity
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1 | Body Features: Shield Plating Material Nickel over Copper | Primary Product Color Black | Shield Plating Finish Bright | Connector Profile Low | Shield Material Zinc | Configuration Features: Number of Positions 50 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 3.5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material | Other | Check Price & Stock |
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SLG55550V
Renesas Electronics
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1 | The SLG55550 is a USB device that combines high speed USB switches with a USB host charger (dedicated charger) identification circuit. The device supports both the latest USB Battery Charging Specification Revision 1.1 including data contact detection and a set resistor bias for Apple compliant devices as well as legacy USB D+/D- short detection using data line pull-up. | Small Outline No-lead | Check Price & Stock |
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5555162-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 8 | Connector Contact Density Standard | Number of Loaded Positions 8 | Port Configuration Single Port | Port Matrix Configuration 1 x 1 | Status Light Type Not Illuminated | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Mating Area Plating Materi | Other | Check Price & Stock |
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5555167-1
TE Connectivity
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1 | Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Status Light Type Not Illuminated | PCB Mount Orientation Right Angle | Number of Positions 8 | Connector Contact Density Standard | Port Configuration Single Port | Number of Loaded Positions 8 | Port Matrix Configuration 1 x 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 50 MICIN | Contact Current Rating (Max) 1.5 AM | Other | Check Price & Stock |
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5555163-5
TE Connectivity
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1 | J11 Connectors, Single Port, 1 x 1, Low Profile, RJ Type Jacks & Plugs, Standard Connector Contact Density, Jack, Standard | Other | Check Price & Stock |
3
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5555164-1
TE Connectivity
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1 | Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Port Configuration Single Port | PCB Mount Orientation Right Angle | Port Matrix Configuration 1 x 1 | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Number of Positions 8 | Connector Contact Density Standard | Contact Features: Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Underplating Material Nickel | Contact Current Rating (Max) .2 AMP | Contact M | Other | Check Price & Stock |
3
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5555141-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | PCB Ground Tab Location 3.05 MM | Shield Material Copper Alloy | Shield Plating Material Tin | PCB Ground Tab Location .12 INCH | Connector Profile Low | Configuration Features: Number of Loaded Positions 8 | Number of PCB Ground Tabs 2 | Connector Contact Density Standard | Status Light Type Not Illuminated | Number of Positions 8 | Port Matrix Configuration 1 x 1 | Port Configuration Single Port | Panel Ground Location Top | PCB Mount O | Other | Check Price & Stock |
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5555248-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Configuration Features: Port Matrix Configuration 1 x 1 | PCB Mount Orientation Right Angle | Port Configuration Single Port | Number of Positions 8 | Status Light Type Not Illuminated | Connector Contact Density Standard | Number of Loaded Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) .2 AMP | Contact Mating Area Plating Material Thickness 50 MICIN | Other | Check Price & Stock |
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