555-5 Model Download Search Results
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555-5303F
Dialight
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1 | 555 Series 2 mm Quad Top View CBI G,G,G,G 5 Volt | Other | 555-5303F |
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555-5007F
Dialight
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1 | LED Circuit Board Indicators 2mm Quad CBI | Other | 555-5007F |
3
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555-5401F
Dialight
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1 | LED Circuit Board Indicators YELLOW DIFFUSED | Other | 555-5401F |
3
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555-5003F
Dialight
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1 | Dialight 555-5003F, Red PCB LED Indicator, 4 LEDs, Through Hole | Other | 555-5003F |
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1755554
Phoenix Contact
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1 | ZFKKDSA 1,5C-5,0-10 - Printed circuit board terminal, nominal current: 16 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm2, number of potentials: 20, number of rows: 2, number of positions per row: 10, product range: ZFKKDS(A) 1,5C, pitch: 5 mm, connection method: Spring-cage connection, mounting: Wave soldering, conductor/PCB connection direction: 45 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.7 mm, number of solder pins per potential: 1, type of packaging: pack | Other | 1755554 |
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1755558
Phoenix Contact
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1 | MSTBVA 2,5/ 6-G - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 6, number of rows: 1, number of positions: 6, number of connections: 6, product range: MSTBVA 2,5/..-G, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignm | Other | 1755558 |
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5555140-1
TE Connectivity
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1 | Shielded Mod jack 6/6 panel+pcb Grd SE | Other | 5555140-1 |
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AD5555CRUZ
Analog Devices
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1 | AD5555CRUZ, 14 bit-Bit DAC Dual, 2Msps, SPI, 16-Pin TSSOP | Small Outline Packages | AD5555CRUZ |
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5555248-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Configuration Features: Port Matrix Configuration 1 x 1 | PCB Mount Orientation Right Angle | Port Configuration Single Port | Number of Positions 8 | Status Light Type Not Illuminated | Connector Contact Density Standard | Number of Loaded Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) .2 AMP | Contact Mating Area Plating Material Thickness 50 MICIN | Other | 5555248-1 |
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5555979-1
TE Connectivity
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1 | Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Loaded Positions 4 | Connector Contact Density Standard | Port Configuration Single Port | Number of Positions 6 | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 1.5 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Materia | Other | 5555979-1 |
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FJD5555TM
onsemi
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1 | Wide Safe Operating Area; High-Voltage Capability; High Switching Speed | Other | FJD5555TM |
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5555077-1
TE Connectivity
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1 | Single Port, 1 x 1, Low Profile, RJ Type Jacks & Plugs, Jack, Standard - Latch Down, Right Angle, Cat 3, Surface Mount, Side Entry, RJ25 Connectors | Other | 5555077-1 |
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1955552
Phoenix Contact
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1 | CCV 2,5/ 5-G-5,08 P26THRR56 - PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 5, number of rows: 1, number of positions: 5, number of connections: 5, product range: CCV 2,5/..-G, pitch: 5.08 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, | Other | 1955552 |
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5555165-5
TE Connectivity
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1 | M/J, LPF, R/A, 6P/2C, TIN, BULK PKG | Other | 5555165-5 |
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ISOM5-555-R-L2
Bourns
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1 | IsoMOV 5KA 555Vrms Reel In-Line Vdc 745V, 40pF, Vc 14000V, Ic 100A, Disc 17mm | Other | ISOM5-555-R-L2 |
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5555164-4
TE Connectivity
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1 | Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: PCB Mount Orientation Right Angle | Status Light Type Not Illuminated | Number of Positions 8 | Port Configuration Single Port | Port Matrix Configuration 1 x 1 | Number of Loaded Positions 8 | Connector Contact Density Standard | Contact Features: Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 1.27 MICM | PC | Other | 5555164-4 |
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10155552-A108KLF
Amphenol
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1 | Automotive Connectors Minitek MicroSpaceXS 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Header Vertical, Tin (preplated) | Other | 10155552-A108KLF |
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5555153-1
TE Connectivity
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1 | Body Features: Shield Material Copper Alloy | Shield Plating Material Tin | Connector Profile Low | PCB Ground Tab Location .12 INCH | PCB Ground Tab Location 3.05 MM | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: PCB Mount Orientation Right Angle | Port Configuration Single Port | Number of PCB Ground Tabs 2 | Number of Positions 8 | Connector Contact Density Standard | Port Matrix Configuration 1 x 1 | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Con | Other | 5555153-1 |
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IsoM5-555-B-L1
Bourns
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1 | IsoMOV 5KA 555Vrms Bulk Straight | Other | IsoM5-555-B-L1 |
3
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FJP5555TU
onsemi
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1 | Wide Safe Operating Area; High Switching Speed; High-Voltage Capability | Transistor Outline, Vertical | FJP5555TU |
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1N5555
Microsemi Corporation
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1 | TVS DIODE 30.5V 47.5V DO13 | Diodes, Axial Diameter Horizontal Mounting | 1N5555 |
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55556-4
TE Connectivity
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1 | Conn Tab RCP 1 POS Press Fit ST Thru-Hole 10 Terminal 1 Port Bulk | Other | 55556-4 |
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WCM5555FASV-301-LM
TAI-TECH
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1 | 2 Line Common Mode Choke Surface Mount 300 Ohms @ 100 MHz 4.8A DCR 7.5mOhm | Other | WCM5555FASV-301-LM |
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5055558-4
TE Connectivity
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1 | Body Features: Terminal Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness 3.04 MICM | Contact Current Rating (Max) 37.8 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness .5 – 3.04 MICM | PCB Contact Termination Area Plating Material Thickness 20 – 120 MICIN | PCB Contact Termination A | Other | 5055558-4 |
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SLG55550V
Renesas Electronics
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1 | The SLG55550 is a USB device that combines high speed USB switches with a USB host charger (dedicated charger) identification circuit. The device supports both the latest USB Battery Charging Specification Revision 1.1 including data contact detection and a set resistor bias for Apple compliant devices as well as legacy USB D+/D- short detection using data line pull-up. | Small Outline No-lead | SLG55550V |
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