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5569263-1
TE Connectivity
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1 | Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Shield Plating Material Tin over Copper | Grounding Tab Plating Material Tin over Copper | Shield Material Copper Alloy | Configuration Features: Number of Positions 8 | Multiple Port Configuration Stacked | Port Configuration Multiple Ports | Status Light Type Not Illuminated | Number of Loaded Positions 8 | Connector Contact Density Standard | Port Matrix Configuration 2 x 6 | PCB Mount Orientation Right Angle | | Other | 5569263-1 |
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5569256-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Shield Material Copper Alloy | Shield Plating Material Tin over Copper | Grounding Tab Plating Material Tin over Copper | Connector Profile Low | Configuration Features: Number of Loaded Positions 8 | Status Light Type Not Illuminated | Connector Contact Density Standard | Multiple Port Configuration Stacked | Port Configuration Multiple Ports | Number of Positions 8 | PCB Mount Orientation Right Angle | Number of PCB Ground Tabs 8 | Port | Other | 5569256-1 |
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5569260-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Grounding Tab Plating Material Tin over Copper | Connector Profile Low | Shield Plating Material Tin over Copper | Shield Material Copper Alloy | Configuration Features: Number of PCB Ground Tabs 6 | Number of Loaded Positions 8 | PCB Mount Orientation Right Angle | Port Configuration Multiple Ports | Multiple Port Configuration Stacked | Status Light Type Not Illuminated | Port Matrix Configuration 2 x 2 | Number of Positions 8 | Connect | Other | 5569260-1 |
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5569255-1
TE Connectivity
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1 | Body Features: Shield Plating Material Tin over Copper | Shield Material Copper Alloy | Grounding Tab Plating Material Tin over Copper | Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Number of Loaded Positions 8 | Status Light Type Not Illuminated | Number of Positions 8 | Port Configuration Multiple Ports | Port Matrix Configuration 2 x 2 | PCB Mount Orientation Right Angle | Connector Contact Density Standard | Number of PCB Ground Tabs 7 | Multiple | Other | 5569255-1 |
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5569254-1
TE Connectivity
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1 | Body Features: Connector Profile Low | Grounding Tab Plating Material Tin over Copper | Shield Material Copper Alloy | Modular Jack Latch Orientation Standard - Latch Down | Shield Plating Material Tin over Copper | Configuration Features: Number of Loaded Positions 8 | Port Matrix Configuration 2 x 8 | Number of PCB Ground Tabs 2 | Port Configuration Multiple Ports | Multiple Port Configuration Stacked | PCB Mount Orientation Right Angle | Status Light Type Not Illuminated | Number of Positions 8 | Connect | Other | 5569254-1 |
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5569284-1
TE Connectivity
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1 | Body Features: Connector Profile Standard | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Positions 8 | Connector Contact Density Standard | Port Configuration Single Port | PCB Mount Orientation Vertical | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Contact Features: Contact Current Rating (Max) 1.5 AMP | Contact Current Rating (Max) .2 AMP | Contact Mating Area Plating Material Gold | Contact Underplating M | Other | 5569284-1 |
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5569284-1
TE Connectivity
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1 | Body Features: Connector Profile Standard | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Positions 8 | Connector Contact Density Standard | Port Configuration Single Port | PCB Mount Orientation Vertical | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Contact Features: Contact Current Rating (Max) 1.5 AMP | Contact Current Rating (Max) .2 AMP | Contact Mating Area Plating Material Gold | Contact Underplating M | Other | 5569284-1 |
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5569262-1
TE Connectivity
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1 | Body Features: Shield Material Copper Alloy | Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Grounding Tab Plating Material Tin over Copper | Shield Plating Material Tin over Nickel | Configuration Features: Number of Positions 8 | Status Light Type Not Illuminated | Port Matrix Configuration 2 x 4 | Multiple Port Configuration Stacked | Port Configuration Multiple Ports | Connector Contact Density Standard | Number of Loaded Positions 8 | PCB Mount Orientation Right Angle | | Other | 5569262-1 |
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5569259-1
TE Connectivity
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1 | Body Features: Shield Material Copper Alloy | Shield Plating Material Tin over Copper | Modular Jack Latch Orientation Standard - Latch Down | Grounding Tab Plating Material Tin over Copper | Connector Profile Low | Configuration Features: Status Light Type Not Illuminated | Port Configuration Multiple Ports | Multiple Port Configuration Stacked | Number of Positions 8 | Connector Contact Density Standard | Number of PCB Ground Tabs 13 | Number of Loaded Positions 8 | PCB Mount Orientation Right Angle | Por | Other | 5569259-1 |
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5569264-1
TE Connectivity
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1 | Body Features: Shield Material Copper Alloy | Modular Jack Latch Orientation Standard - Latch Down | Shield Plating Material Tin over Copper | Grounding Tab Plating Material Tin over Copper | Connector Profile Low | Configuration Features: Number of Loaded Positions 8 | Number of Positions 8 | Number of PCB Ground Tabs 6 | Connector Contact Density Standard | Status Light Type Not Illuminated | Port Matrix Configuration 2 x 8 | Multiple Port Configuration Stacked | Port Configuration Multiple Ports | PCB Mo | Other | 5569264-1 |
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5569257-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Shield Material Copper Alloy | Grounding Tab Plating Material Tin over Copper | Shield Plating Material Tin over Copper | Configuration Features: Number of PCB Ground Tabs 9 | PCB Mount Orientation Right Angle | Port Matrix Configuration 2 x 4 | Multiple Port Configuration Stacked | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Number of Positions 8 | Port Configuration Multiple Ports | Connect | Other | 5569257-1 |
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5569261-1
TE Connectivity
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1 | Body Features: Shield Plating Material Tin over Copper | Shield Material Copper Alloy | Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Grounding Tab Plating Material Tin over Copper | Configuration Features: Status Light Type Not Illuminated | Number of Loaded Positions 8 | Number of PCB Ground Tabs 6 | Port Matrix Configuration 2 x 3 | Connector Contact Density Standard | Number of Positions 8 | Port Configuration Multiple Ports | PCB Mount Orientation Right Angle | Multiple | Other | 5569261-1 |
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5569-24A7
Molex
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1 | Headers & Wire Housings 2 CKT R/A HEADER | Other | 5569-24A7 |
3
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5569-24A1
Molex
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1 | Mini-Fit Jr. Header, Dual Row, Right-Angle, with PCB Mounting Flange, 24 Circuits, PA Polyamide Nylon 6/6 94V-2, Tin (Sn) Plating | Other | 5569-24A1 |
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556926-1
TE's AMP
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1 | 8 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SOLDER, JACK | 556926-1 |
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556926-1
TE Connectivity
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1 | PHONE CONNECTOR,PCB MNT,8 CONTACTS,PIN,PC TAIL TERMINAL,LOCKING | 556926-1 |
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Build or Request | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5569253-1
TE Connectivity
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1 | Body Features: Shield Material Copper Alloy | Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Grounding Tab Plating Material Tin over Copper | Shield Plating Material Tin over Copper | Configuration Features: Status Light Type Not Illuminated | Multiple Port Configuration Stacked | Port Configuration Multiple Ports | PCB Mount Orientation Right Angle | Number of Loaded Positions 8 | Port Matrix Configuration 2 x 6 | Connector Contact Density Standard | Number of Positions 8 | | 5569253-1 |
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556926
Spectrum Control
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1 | Telecom and Datacom Connector, 8 Contact(s), Female, Solder Terminal, Jack | 556926 |
0
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Build or Request | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5569250-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Shield Plating Material Tin over Nickel | Connector Profile Low | Grounding Tab Plating Material Tin over Copper | Configuration Features: Connector Contact Density Standard | Number of PCB Ground Tabs 2 | Multiple Port Configuration Stacked | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Number of Positions 8 | PCB Mount Orientation Right Angle | Port Matrix Configuration 2 x 2 | Port Configuration Multiple Ports | C | 5569250-1 |
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5569282-1
TE Connectivity
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1 | MJ,TE,4P,PNL STOPS | 5569282-1 |
0
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Build or Request | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5569252-1
TE Connectivity
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1 | STK MJ ASSY,8POS,2X4,CAT5 | 5569252-1 |
1
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556920-1
TE Connectivity
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0 | 556920-1 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PFC-W1206R-15-5692-Q
TT Electronics Resistors
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1 | Fixed Resistor, Thin Film, 0.333W, 56900ohm, 200V, 0.02% +/-Tol, -15,15ppm/Cel, 1206, | PFC-W1206R-15-5692-Q |
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Build or Request | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GP65-5692-CB50W
RCD Components Inc
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1 | Fixed Resistor, Metal Film, 1W, 56900ohm, 400V, 0.25% +/-Tol, 50ppm/Cel, | GP65-5692-CB50W |
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Build or Request | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5-569286-3
TE's AMP
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1 | 8 CONTACT(S), MALE, TELECOM AND DATACOM CONNECTOR, CRIMP, PLUG | 5-569286-3 |
0
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Build or Request | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||